200mm

The Filmetrics R50 – 200 – 4PP is a metrology tool configured by default for metallic layers and sample thicknesses of 525 µm ± 25 µm.

The Plasma Therm 720/740 is a dual-chamber RIE loadlocked system with chlorine- and fluorine-based chemistry.

Oxford Instruments Plasmalab 80+ is a compact open-loading reactive ion etch system for R&D or small-scale production.

Veeco Dektak 150 is a stylus-based surface profiler used for measuring surface topography and thin film step heights.

The LabSpin6 / 8 is a manual coating and developing system for substrates up to 200 mm, capable of spin coating and puddle developing.

The HP8, CP8, and VP8 are manual coating and developing systems from SUSS MicroTec, supporting wafers up to 200 mm and offering baking, cooling, and vapor priming capabilities.

The SUSS MicroTec SB6 / 8 Gen2 is a semi-automated wafer bonding system capable of handling wafers up to 200 mm.

The SUSS MicroTec XB8 is a semi-automated wafer bonding system for substrates up to 200 mm, supporting high-force wafer bonding.

SPTS lists the c2L as a 200mm tool in its Equipment Training course offerings.

The Tegal 3200 SE is an advanced cluster platform for 3D IC and MEMS applications that can be configured with up to 3 process modules.

Nikon NSR 2205 i 14 E 2 is an i-line stepper.

The CEE 200CBX is a precision coat-bake system described as a track-quality spin coater with a high-uniformity bake plate.

The Denton 635LL is a four-cathode sputter deposition system that coats substrates up to 200 mm in diameter.

The J.A. Woollam RC2 is a spectroscopic ellipsometer used to measure thin-film thickness and refractive indices.

The Tegal 4200 SE is an advanced cluster platform for 3D IC and MEMS applications.

The Memsstar Orbis Alpha Oxide Etch System is a small-footprint, self-contained oxide etch system that uses hydrogen fluoride etchants.

The Thermo Fisher Scientific / FEI NanoLab 1200 AT FIB is a focused ion beam system with an integrated Electron column and supporting inspection, wafer handling, and gas delivery components.

The Semitool 4300 S SRD is a spin rinse dryer with a single-stack configuration and 200mm wafer particle specification.

The AJA BSG-200 Series is a substrate holder for wafers or similar planar substrates up to 200 mm in diameter with direct backside gas cooling while rotating.

The ASM E 2000 is a radiantly heated, single-wafer epitaxial reactor for chemical vapor deposition of doped or undoped silicon layers on wafers up to 200 mm (8 inches).

The ASML PAS 5500/275D is a high-throughput i-line stepper with 5X reduction, 365 nm exposure, and automated wafer handling for substrates up to 200 mm diameter.

The SUSS MicroTec BA8 Gen4 Pro is a semi-automated mask alignment and wafer bonding system for 200 mm wafers, with capabilities including exposure, UV bonding, fusion bonding, imprinting, and selective plasma activation.

The GCA AutoStep 200 DSW (also known as AS200) is a 5X reduction i-line wafer stepper designed for up to 200mm wafers.

The CEE 200 Bake Plate is a bake plate for up to 200mm wafers with Internal OS software and 208V power.

The SCREEN / DNS SS W 80 A-AR is a scrubber with 8 inch wafer size support.

The Despatch AST-3100 is an automated polyimide curing tool designed for 200mm and 300mm wafers.

Tegal 980 ACS is a plasma etch system series described as serving the 200mm fab line.

Oxford Instruments PlasmaPro80 is an RIE dry etcher used for hBN, SiGe, graphite, and graphene etching.

The ZYGO Z3D-7000 is a non-contact, optical metrology system for semiconductor wafers that accommodates 200 mm and 300 mm wafer sizes.

Zeiss 200 mm Scanning Electron Microscope.

The AJA BSG-200 Series Substrate Holder is a backside-gas-cooled rotating substrate holder for wafers or similar planar substrates up to 200 mm in diameter.

EVG40 is an EV Group top-to-bottom side alignment accuracy measurement inspection system for non-destructive measurement of repeatable alignment accuracy.

The Disco DFL7340 stealth dicing system is used for dicing silicon wafers and is dedicated to Si wafers only.

The EV Group 850 LT SOI Fusion Wafer Bonder is a fully automatic wafer bonder configured for 8-inch/200mm wafers.

The Laurell WS-650-8B is a compact 650-series spin coater with a maximum rotational speed of 12,000 RPM and support for wafers up to 200 mm.

The YES 8-2P-CP is a manual-load high-temperature cure oven in the PB Series, specified for 200 mm wafers.

The KLA Archer 10 XT Overlay System is a 200mm overlay metrology system with refurbishment-upgraded components and software version 5.6.

The Laurell WS-650-8B is a spin coater in the 650 Series with a maximum substrate size of ø200mm (7" x 7") and a maximum speed of 12,000 rpm.

The Laurell EDC-650-8B is an EDC System 650 Series spin coater with a maximum substrate size of 200mm (7" x 7").

The Laurell WS-650-8 B is a 650-series spin coater with a maximum substrate size of 200mm (7" x 7") and a maximum speed of 12000 rpm.

The Laurell EDC-650-8 B is an EDC System 650-series spin coater with a maximum substrate size of ø 200mm (7" × 7") and a maximum speed of 12000 rpm.

The SUSS MicroTec MA200 Gen3 is a fully automated mask aligner for high-volume lithography on wafers and square substrates up to 200 mm.

The Laurell H6-8 B is a spin coater in the 650-series with a maximum substrate size of 200mm (7" x 7"), a maximum speed of 12000 rpm, and tabletop, in-deck, or on-deck mounting options.

Laurell EDC-HL-8 B is an EDC System 650-series spin coater with a maximum substrate size of 200mm (7" x 7").

The SPTS MVD300 is a Molecular Vapor Deposition system designed for high-performance, flexible, reliable high-volume manufacturing applications.

The Filmetrics F54 is a spectroscopic ellipsometer for measuring thin-film thickness and refractive index.

The EVG Gemini Automated Production Wafer Bonder is a wafer bonder with face-to-face alignment and automation features, supporting wafers up to 8"/200mm.

The KLA Tencor P-15 is a profilometer with a 200 mm sample table with vacuum.

The MPI TS2000-IFE is a 200-mm automated probe station with micron precision used in a terahertz small-signal probe station configuration.

The Filmetrics RS50 is a 4-point probe mapping system for sheet resistance measurement.

The Laurell EDC-650-8 is a station-mounted spin processor that accommodates up to 200 mm wafers and 7 in x 7 in substrates.

The SPTS MVD100E is a Molecular Vapor Deposition system designated for R&D or pilot manufacturing.

The Disco DFL7340 stealth dicing system is used for dicing silicon wafers and is dedicated to Si wafers only.

Electroglas EG4|200 is a wafer prober for 200mm wafer applications, and the EG4|200e is a related variant described for ultra-low-noise probing.

The Oxford Instruments PlasmaPro NGP80 is a modular, benchtop-scale plasma processing platform for precision thin-film deposition and reactive ion etching (RIE).

The PlasmaPro NGP80 RIE is an Oxford Instruments reactive ion etching system used for processes such as SiO2 hard mask etching with CHF3/Ar plasma at 20°C.

The Laurell EDC-HL-8 B is a compact EDC spin processor that accommodates up to 200 mm wafers and 7 in × 7 in substrates.

The Laurell H6-8 is a 650-series HL spin coater that accommodates up to 200mm wafers and 7" × 7" substrates and has a maximum rotational speed of 12,000 RPM.

The KLA Tencor P-2 is a profilometer with a 200 mm sample table with vacuum and a 3D scan option.