Waferpedia

EV Group

Gemini Automated Production Wafer

The EV Group Gemini Automated Production Wafer Bonder is a fully automated wafer bonding system. The EV Group Gemini Automated Production Wafer Bonder handles wafers up to 8"/200mm. The EV Group Gemini Automated Production Wafer Bonder includes face-to-face alignment.[1][2]

Gemini Automated Production Wafer — Inventory photo
Fig. 01Gemini Automated Production WaferInventory photo[1]
  • Plate 01EVG Gemini Fully Automated Production Bonding System

    Lithography Equipment SupportWatch on YouTube

Wafer size

200mm

Performance

with Face to Face Alignment[1]

Gas delivery

1 purge gas line for process gas[1]

What it is

The EV Group Gemini Automated Production Wafer Bonder is a wafer bonding system for advanced packaging. The machine supports fully automated wafer loading, alignment, bonding, and unloading of bonded wafers.[2]

How it works

General reference — not yet source-verified

A production wafer bonder in this class typically receives prepared wafers after front end patterning or after intermediate integration steps, then aligns and bonds them before later thinning, singulation, or package completion steps. The machine supports automated recipe control for production flow management.

What do the numbers mean?

Wafer handling5

4 Axis Industrial Robot[1]
Accurate?
Open cassette loading with empty/present sensor[1]
Accurate?
Wafer size
up to 8"/200mm[1]
Accurate?
Automation
Fully automated wafer loading, alignment, bonding and unloading[2]
Accurate?
Loaded features
Flexible process flow definition, drag and drop recipe programming, parallel processing of multiple jobs, automated recording of process and machine parameters, throughput optimized handling sequence, password protected user access levels, open cassette loading with empty/present sensor[1]
Accurate?

Gas & chemistry2

1 purge gas line for process gas[1]
Accurate?
Process gas
1 purge gas line for process gas[1]
Accurate?

Optics & imaging2

SmartView®NT Alignment Module with 5x Objectives[1]
Accurate?
Alignment module
SmartView®NT Alignment Module with 5x Objectives[1]
Accurate?

Performance5

with Face to Face Alignment[1]
Accurate?
Throughput optimized handling sequence[1]
Accurate?
Alignment
Face to face alignment[1]
Accurate?
Alignment options
Bottom side, IR or SmartView alignment[2]
Accurate?
Temperature uniformity
Excellent temperature uniformity, stability and reproducibility[2]
Accurate?

Control & software3

EVG CIM Framework Software GUI (Graphical User Interface)[1]
Accurate?
Drag and drop recipe programming[1]
Accurate?
Software
EVG CIM Framework Software GUI[1]
Accurate?

Configuration & options20

Interlocked doors with signal light tower[1]
Accurate?
Flexible process flow definition[1]
Accurate?
Parallel processing of multiple jobs[1]
Accurate?
Automated recording of process and machine parameters[1]
Accurate?
Password protected user access levels[1]
Accurate?
Tooling included
8” bond chucks (additional tooling can be offered)[1]
Accurate?
Temperature
4 Bond modules with up to 550°C and 20kN bond force[1]
Accurate?
Formic Acid Bubbler option for purging formic acid vapor into bond chamber[1]
Accurate?
CE Certified[1]
Accurate?
Bonding chambers
Multiple bonding chambers, up to ten[2]
Accurate?
Bonding modes
Anodic, thermo-compression or silicon fusion bonding[2]
Accurate?
Contact force
up to 40 kN[2]
Accurate?
Temperature
up to 550°C[1]
Accurate?
Bond modules
4 Bond modules[1]
Accurate?
Bond force
20 kN bond force[1]
Accurate?
Design
Modular design with swap-in modules[2]
Accurate?
Cleanroom compatibility
Class 1 clean room compatible design[2]
Accurate?
Tooling included
8” bond chucks[1]
Accurate?
Certification
CE Certified[1]
Accurate?
Vintage
2014 Vintage[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Configuration1 purge gas line for process gas[1]
  • Process gas1 purge gas line for process gas[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the Gemini Automated Production Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Gemini Automated Production Wafer are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Gemini Automated Production Wafer are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Gemini Automated Production Wafer are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Gemini Automated Production Wafer are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Gemini Automated Production Wafer is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]web.archive.org — evgroup.com (Feb 18, 2005)web.archive.org
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Last updated Oct 4, 2026.

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