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memsstar

Orbis Alpha

Etch200mmmemsstar Orbis Alpha family
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The Memsstar Orbis Alpha is a small footprint, self-contained oxide etch system. The Orbis Alpha uses hydrogen fluoride etchants with memsstar's patented high volume production process. The Orbis Alpha handles materials from sample sizes up to 200 mm and provides excellent uniformity and repeatability (<5% 1σ).[1]

memsstarOrbis Alpha
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Wafer size

200mm

Performance

< 5% 1σ[1]

Gas delivery

hydrogen fluoride etchants[1]

What it is

The memsstar Orbis Alpha is a self-contained oxide etch system with a small footprint. The system uses hydrogen fluoride etchants along with a patented high-volume production process. The Orbis Alpha is intended to enable researchers to develop production-capable processes for the next generation of MEMS devices.[1]

How it works

General reference — not yet source-verified

The etch process typically involves vapor-phase hydrogen fluoride reacting with oxide layers to form volatile byproducts. Endpoint detection allows precise control of the etch depth and termination.

Where it fits in the process flow

General reference — not yet source-verified

In MEMS fabrication, such oxide etch systems are commonly placed after deposition and photolithography steps. The system is often used for sacrificial layer removal to release moving structures, and for patterning oxide layers. The process can also be employed for cleaning residual oxides from prior steps.

Applications

The memsstar Orbis Alpha is used for RF MEMS, sensors, RF switches, and temperature gauges. The system is also aimed at developing production-capable processes for next-generation MEMS devices.[1]

  • RF MEMS
  • Sensors
  • RF switches
  • Temperature gauges
  • development of production-capable processes for MEMS devices

What do the numbers mean?

Wafer handling1

Substrate size range
sample sizes to 200 mm[1]
Accurate?

Gas & chemistry1

Process chemistry
hydrogen fluoride etchants[1]
Accurate?

Performance3

Uniformity
< 5% 1σ[1]
Accurate?
Repeatability
< 5% 1σ[1]
Accurate?
Uniformity and repeatability
<5% 1σ[1]
Accurate?

Control & software3

Control
PC controlled[1]
Accurate?
User interface
resistive touch screen[1]
Accurate?
Control interface
PC controlled with resistive touch screen[1]
Accurate?

Dimensions & facilities3

Footprint
small footprint[1]
Accurate?
Dimensions
600 x 540 x 900 mm[1]
Accurate?
Footprint
600 x 540 x 900 mm[1]
Accurate?

Configuration & options6

System type
oxide etch system[1]
Accurate?
Selectivity to silicon nitride and silicon dioxide
< 5% 1σ[1]
Accurate?
Endpoint capability
unique endpoint capability[1]
Accurate?
Selectivity (silicon nitride and silicon dioxide)
excellent (<5% 1σ)[1]
Accurate?
Endpoint detection
unique endpoint capability[1]
Accurate?
Process window
large process window to optimize process for any structure[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Process chemistryhydrogen fluoride etchants[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What is the physical footprint of the memsstar Orbis Alpha?

The system has a footprint of 600 x 540 x 900 mm.[1]

What sample sizes can the system handle?

The system handles materials from sample sizes up to 200 mm.[1]

What selectivity does the system offer?

The system provides high selectivity to silicon nitride and silicon dioxide, with uniformity and repeatability below five percent one sigma.[1]

Does the system have endpoint detection?

The system features a unique endpoint capability.[1]

What are the primary applications of the Orbis Alpha?

Applications include RF MEMS, sensors, RF switches, and temperature gauges.[1]

How is the system controlled?

The system is PC controlled and features a resistive touch screen.[1]

Not publicly documented

The following facts about the Orbis Alpha are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Orbis Alpha are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Orbis Alpha are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Orbis Alpha are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Orbis Alpha are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Orbis Alpha is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]pnf.uchicago.edu — pnf.uchicago.edupnf.uchicago.edu
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Last updated Sep 21, 2026.

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