SUSS MicroTec
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The HP8, CP8, and VP8 are manual systems that combine baking, cooling, and vapor priming capabilities in a single platform.[1]
The HP8, CP8, and VP8 are used for coating and developing process steps, which are part of the lithography sequence in semiconductor and microsystems fabrication.[1]
The HP8, CP8, and VP8 are used in coating and developing applications that involve baking, cooling, and vapor priming.[1]
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The following facts about the HP8 / CP8 / VP8 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the HP8 / CP8 / VP8 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the HP8 / CP8 / VP8 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the HP8 / CP8 / VP8 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the HP8 / CP8 / VP8 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the HP8 / CP8 / VP8 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 22, 2026.
The LabSpin6 / 8 is a manual coating and developing system for substrates up to 200 mm, capable of spin coating and puddle developing.
The Thermo Fisher Scientific / FEI NanoLab 1200 AT FIB is a focused ion beam system with an integrated Electron column and supporting inspection, wafer handling, and gas delivery components.
The ABM-407B-2-S-CE-S293 is a robot.