Denton Vacuum
The Denton 635LL is a multi-cathode sputter deposition system that coats substrates up to 200 mm in diameter. The Denton 635LL features four cathodes, residual gas analysis (RGA), and optical emission spectroscopy (OES) feedback for reactive sputtering with oxygen or nitrogen. The Denton 635LL includes a heated/cooled chuck rated to 500 °C and supports co-sputtering.[1][2][3]
Wafer size
200mm
Gas delivery
Included[1]
The Denton Vacuum 635LL is a thin film deposition tool used for sputtering in a cleanroom environment.[1][2][3]
The Denton Vacuum 635LL is used for sputtering metals, alloys, oxides, and ceramics.[1][2][3]
The Denton Vacuum 635LL is used for reactive sputtering with oxygen or nitrogen and for co-sputtering of deposited films.[1][2][3]
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The following facts about the 635LL are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 635LL are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 635LL are on record.
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The control-system platform and OS era of the 635LL are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 635LL are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 635LL is not on record.
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Last updated Oct 3, 2026.
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