SUSS MicroTec
BA8 Gen4 Pro
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
The BA8 Gen4 Pro is a semi-automated system that supports wafer sizes up to 150 mm or 200 mm. The BA8 Gen4 Pro is a configuration of the MA/BA Gen4 Pro series. The system includes mask alignment, bond alignment, and exposure capabilities. The system supports UV bonding and fusion bonding. The system also supports micro- and nanoimprinting and selective plasma activation.[1]
How it works
General reference — not yet source-verifiedExposure is performed using a UV light source, typically a mercury lamp, through the mask. Bonding can be UV-activated using UV-curable adhesives or fusion bonding under elevated temperature and pressure. Selective plasma activation may be used to treat surfaces prior to bonding to enhance adhesion. Micro- and nanoimprinting involves pressing a template into a resist layer to create patterns.
Where it fits in the process flow
General reference — not yet source-verifiedUpstream steps include thin-film deposition, etching, and resist coating. Downstream steps include dicing and packaging.
Applications
The BA8 Gen4 Pro system supports mask and bond alignment, exposure, UV bonding, fusion bonding, micro- and nanoimprinting, and selective plasma activation.[1]
- MEMS
- Advanced packaging
- Backend lithography
What do the numbers mean?
Wafer handling1
Optics & imaging1
- Processes
- Mask alignment, Bond alignment, Exposure, UV bonding, Fusion bonding, Micro- and Nanoimprinting, Selective plasma activation[1]
Configuration & options1
What replaced it?
Related models
- siblingSUSS MicroTec MA / BA Gen4 Pro Series— The series includes both MA and BA configurations; BA8 Gen4 Pro is a specific configurationsource[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes does the BA8 Gen4 Pro support?
The BA8 Gen4 Pro supports wafers up to 150 mm or 200 mm.[1]
Is the BA8 Gen4 Pro an automated system?
The BA8 Gen4 Pro is a semi-automated system.[1]
What bonding types are available on the BA8 Gen4 Pro?
The system supports UV bonding and fusion bonding.[1]
Does the BA8 Gen4 Pro include mask alignment capability?
Yes, the system includes mask alignment and bond alignment.[1]
What additional process capabilities does the BA8 Gen4 Pro have?
The system includes micro- and nanoimprinting and selective plasma activation.[1]
Not publicly documented
The following facts about the BA8 Gen4 Pro are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the BA8 Gen4 Pro are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the BA8 Gen4 Pro are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the BA8 Gen4 Pro are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the BA8 Gen4 Pro are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the BA8 Gen4 Pro is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]hilpert.ch — hilpert.chhilpert.ch
Last updated Oct 1, 2026.
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