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MRSI-HVM1 is a high-volume manufacturing flip-chip die bonder with 1 micron accuracy.
ASM XP8 is a registered trademark in ASM's product portfolio.
The Agilent 11729C Carrier Noise Test Set is an integral part of a phase noise measurement system, capable of up-converting, down-converting, and phase/frequency demodulation.
The Edwards PD3 plate degasser is a vacuum coating system for degassing photographic films and plates before use in electron microscopes.
The Tegal 901G is a diode plasma etcher specially configured for GaAs processing and used for etching high-performance devices on gallium arsenide substrates.
The Electroglas EG 6000 e is a wafer prober used in semiconductor test and probe applications.
The Filmetrics F80-A is a film thickness mapping tool for patterned wafers that combines full F80 functionality with Ricmar's WTT 300 Wafer Transfer Tool in a single EFEM platform.
The MRSI-175Ag is a servo-controlled conductive epoxy dispenser with two configurable heads and Windows Workcell software.
The Signatone S-96MW is a micropositioner.
The Sonix SDC5600 is a Motorola DSP56002-based digital signal processing board for IBM compatible computers.
The Wyko HD8000 is a non-contact optical profiler for magnetic thin-film heads that measures pole-tip recession or ABS flatness in less than 3 seconds.
Temescal Model 3CK SuperSource is a removable-cover multi-pocket electron-beam source rated up to 12 kW.
The Hitachi S 9200 is a scanning electron microscope (SEM) used for critical dimension (CD) measurements and wafer inspection, designed for 8-inch wafer processing.
The Temescal 3PT is a PopTop multi-pocket electron-beam source rated up to 12 kW.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.
Leica KMR3 is a glass knifemaker used for trimming and rough cutting specimens.
Canon is a manufacturer that produces semiconductor manufacturing equipment, including photolithography equipment such as steppers and scanners.
The Newport Model 91159 is a full spectrum solar simulator that produces power equivalent to about 1 sun.
The FEI Nova 600i (also called Nova NanoLab 600i) is a DualBeam system combining a field emission scanning electron microscope (FESEM) with a gallium focused ion beam (Ga FIB) for nanoscale prototyping, machining, characterization, and analysis of structures below 100 nm.
The Leica DM2700 M is an upright materials microscope with universal white light LED illumination designed for routine inspection tasks in metallography, earth science, forensic investigation, and materials quality control and research.
The Lam Research TCP 9400 ICP is an inductively coupled plasma etcher from Lam Research.
The OAI 306 is a handheld UV power meter (radiometer) made by Optical Associates Inc. for measuring ultraviolet light intensity in real time.
The Zeiss LSM 880 is a laser scanning confocal microscope.
The Wyko NT1100 is an optical profiler in the Wyko optical profiler product line.
The YES-PB6 was a tabletop vacuum cure system in the PB Series, and support for it was discontinued effective January 1, 2021.
The Tokyo Electron A 8 S ZA is a PoCl3 furnace with an EPROM based control system.
The ZEISS Axioscope 5 is a smart upright microscope designed for biomedical routine and research, featuring automatic digital documentation with a Snap button and support for multiple contrast techniques.
The South Bay Technology D500i is a dimpler used for dimple grinding samples for transmission electron microscopy (TEM).
The Wyko SP3200 is a gauge-capable advanced packaging profiling system for in-line process monitoring of flip-chip packaging.
The Balzers Pfeiffer TPG 300 Pressure Controller is a pressure controller that includes an IKR 020 gauge.
The Strasbaugh 6 AI-DC 6 is a polisher.
The CV200RF Series is a plasma strip/descum system line with automated wafer handling, used for photoresist removal, polyimide removal, organics removal, CD master cleaning, and descum processes.
The Filmetrics F20-EXR uses spectral reflectance for measuring ITO thickness and other display-layer films.
The Edwards EPM75 is a planar magnetron sputtering source for vacuum coating systems.
The DEK 288 is a screen printer for printed circuit boards, supporting board sizes up to 510x510 mm with vision alignment accuracy of 25 µm.
The YES 12-2P-CP is a manual-load high-temperature cure oven for MEMS and semiconductor process applications.
The Zeiss Contura X 700 / X 1000 is a measuring machine manufactured by Zeiss.
The Laurell WS-1000MH is a mini wet station in the WS-1000MH series of mini spin-process stations.
YES-3TA is a Vacuum Bake / Vapor Prime system in the YES Vacuum Bake/Vapor Prime product line, with capacity for 8 cassettes of 4-inch wafers or 1 cassette of 5-8 inch wafers.
The Filmetrics R50 – 200 – 4PP is a metrology tool configured by default for metallic layers and sample thicknesses of 525 µm ± 25 µm.
The Samsung Galaxy S5 is an Android smartphone announced in February 2014 and released in April 2014, featuring a 5.1-inch Super AMOLED display, a 16 MP rear camera, and IP67 dust/water resistance.
The MRSI-M5 is an assembly work cell for precision automation and advanced assembly tasks including epoxy die attach, eutectic bonding, and flip chip bonding.
The Semitool ST 260 SRD is a spin rinse dryer designed for processing 2-inch wafers.
Raith eLINE Plus is a multi-technique electron beam lithography and nanoengineering system with an open, upgradable platform and integrated nanomanipulation and focused electron beam induced process capabilities.
The YXLON FF20 CT is a high-precision industrial computed tomography system for electronic applications and small-scale electronics components.
Der Despatch 60MW ist ein Trocken/Brennofen mit infraroter Heiztechnik, ausgelegt für hohe Durchsatzleistung, konsistente Prozessreproduzierbarkeit und maximale Betriebslaufzeit.
The Brooks / PRI DBM 2706 is an atmospheric wafer handling robot with a dual-arm configuration.
The Despatch LCD1-16NV-3 is an oven for polymer curing with nitrogen circulation, a HEPA filter, and temperature monitoring capability.