Tool family
The SUSS MicroTec BA8 Gen4 Pro is a semi-automated mask alignment and wafer bonding system for 200 mm wafers, with capabilities including exposure, UV bonding, fusion bonding, imprinting, and selective plasma activation.
The SUSS MicroTec BA8 Gen4 Pro is a semi-automated mask alignment and wafer bonding system for 200 mm wafers, with capabilities including exposure, UV bonding, fusion bonding, imprinting, and selective plasma activation.