Applied Materials
Centura AP Enabler Dielectric
Wafer size
Diameter 300+/- 0.05mm(SEMI M28), 775 +/- 25um, Notch
Power
208V, 50/60Hz[1]
Vacuum
SMC pressure switch[1]
Gas delivery
C4F6 100 sccm UNIT IFC-125[4]
What is it?
What do the numbers mean?
Power & electrical5
- RF Gen Top (162MHz Source)
- 3500W RF POWER SUPPLY, 162 MHZ, FIXED FREQUENCY, 208VAC, WATER COOLED (0190-29389)[4]
Vacuum & pumping7
Wafer handling9
Gas & chemistry14
Control & software3
Configuration & options20
- HDD not included[1]
- MENV and FMS assemblies[1]
- EMO Type
- Turn to Release (Front x3, Rear x4) - 3 on FI, 1 on front of FI and one on each side of FI. Rear: 1 for each process chamber.[1]
- System Monitors
- Monitor #1 is Flat Panel with Keyboard on stand / Monitor #2 is through the wall flat panel (optional)[1]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Centura AP Enabler E5 | — | 2010 | Dielectric Etcher with 4 process chambers; Fab Interface type: Centura Etch 5.3 FAC; Frame 5.3 Fi Rev 002 | fabsurplus.com[4] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Facility PlateN2 Regulator : Supplied by customer in floor, CDA regulator 125 PSI onboard[1]
- ConfigurationSMC pressure switch[1]
- Facility PlatePressure Gauge : Supplied by customer on regulator in floor[1]
- Transfer Pressure Monitor10 Torr Manometer and 1SLM N2 APC, kit[1]
- Transfer Pressure MonitorGAUGE VAC MINI-CONVECTRON W/1-SETPOINT CAJON FTG analog[1]
- Load Lock Pressure MonitorGAUGE VAC MINI-CONVECTRON W/1-SETPOINT CAJON FTG analog[1]
- Voltage208V, 50/60Hz[1]
- RF Gen Top (162MHz Source)3500W RF POWER SUPPLY, 162 MHZ, FIXED FREQUENCY, 208VAC, WATER COOLED (0190-29389)[4]
- RF Gen #1 Bottom (13MHz Bias)RF GENERATOR, 13MHZ 5KW, 300MM, RACK MOUNT (0190-15319)[4]
- RF Gen #2 Bottom (2MHz Bias)RF GEN PLASMA 9KW 2MHZ ENI (0190-29586)[4]
- Dry PumpN(ESR80WN (EBARA); customer Supply)[4]
- Chamber Controller ModuleSBC C400MHZ, 3U CPCI, 256MB RAM[4]
- Gas Line 1C4F6 100 sccm UNIT IFC-125[4]
- Gas Line 2CH2F2 100 sccm UNIT IFC-125[4]
- Gas Line 3C3F8 50 sccm UNIT IFC-125[4]
- Gas Line 4O2_M 300 sccm UNIT-125[4]
- Gas Line 5SO2 200 sccm UNIT IFC-125[4]
- Gas Line 6CF4 200 sccm UNIT IFC-125[4]
- Gas Line 7C4F6_IGI 5 sccm UNIT-125[4]
- Gas Line 8O2_IGI 5 sccm UNIT-125[4]
- Gas Line 9O2_L 50 sccm UNIT-125[4]
- Gas Line 10O2_H 5000 sccm UNIT-125[4]
- Gas Line 11Ar 2000 sccm UNIT-125[4]
- Gas Line 12N2 200 sccm UNIT-125[4]
- Gas Line 13CHF3 200 sccm UNIT-125[4]
- Gas Line 14C4F8 100 sccm UNIT-125[4]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the Centura AP Enabler Dielectric are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Centura AP Enabler Dielectric are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Centura AP Enabler Dielectric are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Centura AP Enabler Dielectric are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Centura AP Enabler Dielectric is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Centura AP Enabler Dielectric are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]fabsurplus.comfabsurplus.com
- [3]fabsurplus.comfabsurplus.com
- [4]fabsurplus.com — fabsurplus.comfabsurplus.com
Last updated Oct 6, 2026.
Compare with similar tools
View all →The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.