SUSS MicroTec
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
Wafer size
150mm
Optics
Mask Alignment, Exposure[1]
The SUSS MicroTec MA100 / 150e Gen2 is an automated mask aligner system for substrates up to 150 mm, combining mask alignment and exposure in a single piece of equipment.[1]
The MA100 / 150e Gen2 operates by bringing a mask into proximity or contact with a substrate, then exposing the arrangement to ultraviolet light to replicate the mask pattern.[1]
The system incorporates automated handling for consistent alignment and exposure, supporting wafer sizes up to 150 mm with capabilities for manual, semi-automated, or automated modes depending on configuration.[1]
In the fabrication flow, the MA100 / 150e Gen2 is used for lithography steps that transfer the required circuit patterns onto wafers, typically after coating with a photosensitive resist and before developing or etching processes.
The mask aligner handles fragile and warped wafers common in MEMS and compound semiconductor processing, contributing to its utility across these sectors.[1]
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The following facts about the MA100 / 150e Gen2 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MA100 / 150e Gen2 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the MA100 / 150e Gen2 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the MA100 / 150e Gen2 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MA100 / 150e Gen2 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MA100 / 150e Gen2 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 22, 2026.
The GCA 6300 DSW is a g-line wafer stepper used for lithography, with source descriptions also identifying related i-line GCA 6300 stepper documentation.
The MA / BA Gen4 Pro Series is a semi-automated mask aligner and bond aligner system supporting wafers up to 150 mm / 200 mm, with capabilities for exposure, UV bonding, fusion bonding, micro- and nanoimprinting, and selective plasma activation.
The Karl Suss MA6 is a high-resolution semi-automated photolithography mask aligner for research, development, and small-volume production.