150mm

The Laurell WS-750Lz-23B is a spin coater in the 750 Series. The Laurell WS-750Lz-23B has a maximum substrate size of ø150mm (5" x 5") and a maximum speed of 12,000 rpm.

The Signatone WL-1160 is an RF/microwave probe station designed for high-frequency, high-power, and millimeter-wave applications.

The Karl Suss MA6 is a high-resolution semi-automated photolithography mask aligner for research, development, and small-volume production.

The Laurell Lz-23 B is a compact 650-series spin coater that accommodates up to 150 mm wafers and 5 in × 5 in substrates.

The Nikon R10 is a 1986 i-line stepper for 150 mm wafers used in semiconductor lithography.

The MA / BA Gen4 Pro Series is a semi-automated mask aligner and bond aligner system supporting wafers up to 150 mm / 200 mm, with capabilities for exposure, UV bonding, fusion bonding, micro- and nanoimprinting, and selective plasma activation.

The MA100 / 150e Gen2 is an automated mask aligner for proximity exposure, supporting wafer sizes up to 150 mm.

The Laurell EDC-650-23 is a 650-series spin processor that accommodates up to Ø 150 mm wafers and 5" × 5" substrates.

KLA P/N: 0023889-00 is a wafer vacuum chuck compatible with KLA SP1 Classic, SP1-TBi, and SP1-DLS systems.

The Heidelberg Instruments MLA150 is a mask-less direct-write lithography system for exposing photoresist on substrates without a photomask.

The Laurell EDC-HL-23 B is a compact EDC spin processor with capacity for up to 150 mm wafers and 5 in x 5 in substrates.

Applied Materials P5000 PECVD is a deposition system with two dedicated dielectric PECVD chambers for silicon dioxide and silicon nitride films.

The SUSS MicroTec SB8e is a VAC substrate bonder for MEMS bonding processes.

General referenceThe Temescal UEFC-4900 is an electron-beam physical vapor deposition system used to deposit thin films in a vacuum environment.

The JEOL JBX-6300FS is an advanced direct-write electron beam lithography system for up to 150mm wafers.

The Tegal 981ACS is a scaled-up version of the 901ACS diode RIE system built for handling 150 mm and 200 mm wafers and large-area etching operations.

The Laurell H6-23 is a compact HL Series spin coater for wafers and substrates, with a maximum rotational speed of 12,000 RPM.

The Laurell 750 Series is a spin coater line for spin coating applications.

The KLA SFS 6420 is a wafer inspection system for non-patterned particle detection, compatible with 150 mm and 200 mm wafers, using an Algon laser source.

Laurell WS-650-23B is a 650 Series spin coater with a maximum substrate size of ø150mm (5" × 5") and a maximum speed of 12,000 rpm.

The Laurell EDC-650-23B is an EDC System spin coater from the 650 Series, supporting substrates up to 150mm diameter and spin speeds up to 12,000 rpm.

The Laurell WS-650-23 B is a 650-series spin coater. The Laurell WS-650-23 B has a maximum substrate size of ø 150mm (5" x 5") and a maximum speed of 12000 rpm.

The Laurell EDC-650-23 B is an EDC System 650-series spin coater with a maximum substrate size of ø 150mm (5" × 5") and a maximum speed of 12000 rpm.

The Kurt Lesker ALD-150LX is a plasma-enhanced atomic layer deposition system used for thin-film growth with atomic-scale control.

The Laurell H6-23 B is a Spin Coater in the 650-series. The Laurell H6-23 B accepts a maximum substrate size of ø 150mm (5" × 5") and is rated to 12000 rpm.

The Laurell EDC-HL-23 B is an EDC System 650-series spin coater with a maximum substrate size of 150 mm (5" x 5") and a maximum speed of 12000 rpm.

The Laurell Lz-23 B is a 650-series spin coater that accepts substrates up to 150mm (5×5 inches) and spins up to 12000 rpm.

The Tegal 900e Series is a single-wafer cassette-to-cassette plasma etch system for non-critical plasma etch processes on 3 in to 150 mm wafers.

The Kurt Lesker ALD-150LX is a plasma-enhanced atomic layer deposition system with a load-locked process chamber and in situ ellipsometer, configured for up to 150 mm wafers.

The EVG 850 SOI Wafer Bonder is a fully automatic wafer bonder suitable for wafer sizes up to 6 inch/150mm and currently configured for 6 inch/150mm wafers.

The Laurell WS-650-23 is a station-mounted spin coater in the WS-650 series that accommodates up to ø 150 mm wafers and 5" × 5" substrates.

The Laurell WS-650 is a spin coater used for spincoating photoresists.

The GCA 3696 is a step-and-repeat camera (photorepeater) built around a DEC PDP-11/04 minicomputer.

The Filmetrics F50 is an optical film thickness and wafer-mapping system for thickness and optical property measurements on substrates.

Electroglas EG5|300 is a wafer prober line that includes the ARGOS and EG5|300e variants.

Laurell's WS-400-6NPP is a 400-series spin coater with a 400-series process controller, a 1.75" vacuum chuck, and support for wafers up to 150 mm.

The GCA 6300 DSW is a g-line wafer stepper used for lithography, with source descriptions also identifying related i-line GCA 6300 stepper documentation.

The Tegal 981 is a plasma etch tool for thin film head fabrication, described as achieving precise photoresist descum with 4:1 anisotropy at low processing temperatures in oxygen-free plasmas.

Temescal SuperSweep64 is a programmable beam sweep controller named in the specifications for the FC-4400 deposition system.

The Temescal Simba2 is a 15-kW e-beam power supply offered as an upgrade option for several Temescal deposition systems.

The YES 6-2P-CP is a manual-load high temperature cure oven designed for 150 mm wafers, used in polyimide cure, BCB bake, and copper anneal applications.

The SUSS PM5 is an analytical probe system intended for precise analysis of devices fabricated on wafers and substrates up to 150 mm in diameter.

The Disco DAD3221 is an automatic dicing saw for 100 mm and 150 mm wafers.

The KLA Alpha Step 500 is a profilometer.