Plasma-Therm
Versaline ICP Deep Silicon
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedAn inductively coupled plasma etcher uses an RF-driven plasma source to create a dense reactive environment above the wafer.
The etcher removes material by directing chemically active plasma species toward exposed areas while a mask protects the intended features.
Where it fits in the process flow
Applications
What do the numbers mean?
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of etcher is the Plasma-Therm Versaline ICP Deep Silicon Etch?
The Plasma-Therm Versaline ICP Deep Silicon Etch is an inductively coupled plasma etcher.[1][2][3][4]
What material is the tool used to etch?
The tool is an Si etcher only, and silicon is the compatible material.[2]
What masking layers are acceptable?
The tool can use resist, silicon dioxide, or chrome as masking layers.[2]
Which materials are incompatible with the tool?
The tool is incompatible with III-V materials, high-k materials, and metal.[2]
Not publicly documented
The following facts about the Versaline ICP Deep Silicon are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Versaline ICP Deep Silicon are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Versaline ICP Deep Silicon are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Versaline ICP Deep Silicon are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Versaline ICP Deep Silicon are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Versaline ICP Deep Silicon is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]research.utexas.edu — research.utexas.eduresearch.utexas.edu
- [3]Versaline ICP Deep Silicon — Plasma-Therm | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [4]Plasma-Therm Versaline ICP family | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 11, 2026.
Compare with similar tools
View all →The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.
