Plasma-Therm

The Plasma Therm 720/740 is a dual-chamber RIE loadlocked system with chlorine- and fluorine-based chemistry.

The Plasma-Therm Versaline is a semiconductor processing platform used for plasma-enhanced chemical vapor deposition (PECVD) and deep reactive-ion etching (DRIE), configured for 4-inch wafers.

The Plasma-Therm Versaline VCX 600 ICP is a 6-inch inductively coupled plasma etch system.

The Powermax30 AIR is a plasma cutting system in Hypertherm’s Powermax product line. The Powermax30 AIR appears in Hypertherm’s product finder for plasma cutting and gouging systems.

The Plasma-Therm Powermax30 XP is a plasma cutting and gouging system from the Powermax product line.

The Powermax33 XP is a Hypertherm plasma cutting system in the Powermax product line.

The Powermax45 SYNC is a Hypertherm plasma cutting system in the Powermax plasma product line.

The Powermax65 SYNC is a Hypertherm plasma cutting system listed among the Powermax SYNC products.

The Powermax105 SYNC is a Hypertherm plasma cutting and gouging system.

The HPR400XD is a Hypertherm plasma cutting and gouging system in the HPR plasma product line.

The Hypertherm Powermax65 SYNC is a plasma cutting and gouging system for handheld and automated cutting of metals.

The MAX42 is a model for which a Duramax retrofit torch is available.

The Powermax600 is a Plasma-Therm model designation that is not described in the provided source text.

The Plasma-Therm SEC-1000/SE-1000 is a product line listed among Plasma-Therm’s plasma processing equipment offerings.

The Corial 200FA is a Plasma-Therm Corial brand product. The Corial 200FA is described as useful for pilot production and experimentation.

The Corial 200S is a Plasma-Therm Corial brand product for R&D and low-volume production. The Corial 200S is described as highly adaptable and useful for pilot production and experimentation.

The Plasma-Therm Corial 200R is a Corial brand product mentioned among Plasma-Therm tools for R&D and low-volume production. The Corial 200R is described as highly adaptable and useful for pilot production and experimentation.

The Plasma-Therm 790 RIE is a reactive ion etch system configured for silicon substrate processing.

The Plasma-Therm 770 SLR series is an inductively coupled plasma (ICP) etch system used for dry etching of materials such as silicon, SiO₂, Si₃N₄, and compound semiconductors.

The Plasmatherm Core Interface is a PECVD (Plasma-Enhanced Chemical Vapor Deposition) system.

The Plasma-Therm Versaline ICP Etcher is an inductively coupled plasma etcher.

The Plasma-Therm DSB 6000 HDRF Plasma Processor is a plasma processing system.

The Plasma-Therm Unaxis Versaline ICP is an inductively coupled plasma etcher.

The Plasma-Therm Dual SLR ICP is an inductively coupled plasma etcher.

The Plasma-Therm 790 Multi-Process is an etch system for 6-inch wafers.

The XPR170 is a Hypertherm plasma cutting system in the XPR product line.

The Plasma-Therm Versaline LACVD is an etch system for 6-inch wafers.

The XPR460 is a plasma cutting system in the XPR product line.

The Powermax105 is a Hypertherm plasma cutting system line identified on Hypertherm's product page as Powermax105 SYNC.

The Plasmatherm / Unaxis 790 RIE is a reactive ion etcher specified for 6-inch wafers.

The Plasma-Therm 790 RIE-PECVD is a single-chamber reactive ion etcher / plasma-enhanced chemical vapor deposition system.

The Powermax45XP is a Hypertherm plasma cutting system family reference listed among Powermax plasma products.

The Powermax85 is a plasma cutting system in the Powermax product line. The Powermax85 appears on Hypertherm’s product finder under plasma cutting and gouging systems.

The Plasma-Therm SSC-1000 is a product line listed among Plasma-Therm plasma processing equipment offerings.

The Plasma-Therm Unaxis 790 is a reactive ion etcher / ICP plasma etch system used for etching polymer, dielectric, silicon, silicon oxide, and silicon nitride materials.

The Plasma-Therm RIE 790 Etching is an etch tool.

The Plasma-Therm 210RL-B is a reactive ion etcher (RIE) tool used for dry etching processes.

The Plasma-Therm SLR-770 ICP is a chlorine etcher configured as an inductively coupled plasma etch system with vacuum load lock and wafer transfer robot.

The Plasma-Therm Versaline VLN ICP is an inductively coupled plasma etcher.

The Plasma-Therm SLR 770 ICP Deep Silicon Etcher is a single-chamber inductively coupled plasma etcher configured for 4-inch wafers.

General referenceThe Plasma-Therm 210RL-A is a reactive-ion etch (RIE) system designed for semiconductor and microelectromechanical systems (MEMS) fabrication, belonging to the class of plasma-based dry etching equipment.

The Plasma-Therm Mark 40 is a wafer-based plasma processing system listed in Plasma-Therm's product lineup for etching and deposition applications.

Plasma-Therm / Unaxis ICP Etcher is an inductively coupled plasma etcher with wafer auto load/unload and support for 2, 3, 4, 6, and 8 inch wafers.

The Plasma-Therm PT 7300 is a plasma-enhanced chemical vapor deposition (PECVD) system.

The Plasma-Therm SEC-600/SE-600 is a Plasma-Therm product line referenced on a Plasma-Therm equipment page. The source does not state the tool type or process function for the SEC-600/SE-600.

The Powermax85 SYNC is a plasma cutting system in Hypertherm’s Powermax SYNC product line.

The Powermax1000 is a plasma cutting and gouging system associated with Hypertherm's Powermax product family.

The MAXPRO200 is a heavy-duty, high-capacity automated and handheld plasma cutting and gouging system from Hypertherm.

The Powermax125 is a Hypertherm plasma cutting system in the Powermax product line. Hypertherm describes Powermax systems as portable plasma cutters with handheld and automated cutting, marking, and gouging capabilities.

The XPR300 is a Hypertherm plasma cutting system in the XPR plasma product line.

The Hypertherm HT2000 is a plasma cutting system that supports the HyPro2000 retrofit torch.

The MAX200 is a Hypertherm plasma product for which a HyPro2000 retrofit torch is offered.

The Plasma-Therm 790 Series RIE is a reactive ion etcher for 6-inch wafers.

The Plasma-Therm SLR 770 Metal is a dual-chamber 4-inch metal etcher with load-locked sample introduction and turbomolecular pumping.

The HPR800XD is a Hypertherm plasma cutting system in the HPR plasma product line.

The Plasma-Therm Shuttleline ICP Etcher is an inductively coupled plasma etcher for 6-inch wafers.

The Plasma-Therm Versalock 700 ICP is an inductively coupled plasma etcher.