Plasma-Therm
RIE790
What is it?
What can it run?
Process applications and technology nodes documented for this tool.
- Dry etching
What do the numbers mean?
Gas & chemistry1
Configuration & options6
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ChemistriesSF6, CHF3, CF4, O2, Ar[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the RIE790 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the RIE790 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the RIE790 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the RIE790 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the RIE790 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the RIE790 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]cores.research.asu.edu — cores.research.asu.educores.research.asu.edu
- [2]Dry etch | NanoFab | Core Facilities | ASU — cores.research.asu.educores.research.asu.edu
Last updated Jul 29, 2026.
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