Esec
Esec 2100 FC hS
The Esec 2100 FC hS is a die bonder for epoxy die attach applications. The Esec 2100 FC hS is a 3rd generation 300 mm high speed platform. The Esec 2100 FC hS supports wafer sizes from 4" to 12" on 8" or 12" wafer frames.[1]
Wafer size
4"
Performance
20 µm @ 3σ (15 µm option)[1]
What it is
How it works
Where it fits in the process flow
General reference — not yet source-verifiedDie bonding sits in the assembly flow after upstream wafer processing and before later packaging steps such as molding and singulation.
Applications
The Esec 2100 hS is capable of running epoxy die attach applications for QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA, and LGA.[1]
The Esec 2100 hS supports wafer sizes from 4 inch to 12 inch on 8 inch or 12 inch wafer frames, die sizes from 0.25 mm to 20 mm, and leadframes from 90 mm to 300 mm in length and 23 mm to 100 mm in width.[1]
- epoxy die attach
- TSOP
- FBGA
What do the numbers mean?
Wafer handling1
Performance1
Dimensions & facilities2
Configuration & options3
Vintage & configurations
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the Esec 2100 FC hS are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Esec 2100 FC hS are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Esec 2100 FC hS are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Esec 2100 FC hS are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Esec 2100 FC hS is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Esec 2100 FC hS are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
Last updated Oct 5, 2026.
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