Esec Esec 2100 FC hS

Models in this family

1. 

   Esec 2100 FC hS3rd generation

   The Esec 2100 FC hS is a die bonder for epoxy die attach applications on wafers from 4 inches to 12 inches. The Esec 2100 FC hS is described as a 3rd generation 300 mm high speed platform.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   Esec 2100 hS iXplus	—	—	—	besi.com[1]
   Esec 2100 sD advanced i	—	—	—	besi.com[1]
   Esec 2100 hS i	—	—	—	besi.com[1]
   Esec 2100 hS	—	—	—	besi.com[1]
   Esec 2100 SC Strip Mapping E142 on Esec Die Bonder	—	—	—	besi.com[1]
   Esec 2100 SSI	—	—	—	besi.com[1]

Sources