SUSS MicroTec SB 6

Models in this family

1. 

   SB 6

   The SUSS SB 6 is a 6-inch wafer bonder with thermal compression and anodic bonding capabilities.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   SB6 GEN2	GEN2	—	Second generation with 550°C heating option	uwaterloo.ca[1]
   SB6/8e	—	—	Semi-automatic wafer bonding system for 150 mm and 200 mm wafers	web.archive.org[2]

2. 

   SB 6 VAC

Sources