Tegal
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The system is configured as an inline (in-line) etcher, meaning wafers are transported through a series of load locks and process stations in a linear fashion, allowing for sequential processing without breaking vacuum.
Inline etchers such as the Tegal 703 RPPS are typically placed in a fabrication line after deposition or photolithography steps to etch patterns into thin films. The etched wafers then proceed to stripping or cleaning stations before further processing.
Plasma etchers are used for a variety of dry-etch processes including the removal of silicon dioxide, silicon nitride, polysilicon, and metals in the fabrication of integrated circuits and microelectromechanical systems.
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The following facts about the 703 RPPS are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the 703 RPPS are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 703 RPPS are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 703 RPPS are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 703 RPPS are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 703 RPPS are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Oct 3, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.