SUSS MicroTec

FC 150 Flip Chip

Packaging & Bonding SUSS MicroTec FC 150 Flip Chip family

Research Quality: 40% complete

The SUSS FC 150 is a flip chip bonder used for bonding semiconductor chips to substrates. The SUSS FC 150 is offered with bond pressure options of 50 kg, 100 kg, or 200 kg depending on configuration. The SUSS FC 150 supports optional features including automatic alignment, a heating chuck, and a Universal Bonding Arm (UBA).^[1]^[2]^[3]^[4]^[5]

FC 150 Flip Chip — Inventory photo — Fig. 01FC 150 Flip ChipInventory photo^[2]

Power

220V, 60Hz^[3]

Vacuum

100 kg Bond Pressure^[1]

Performance

Automatic Alignment^[2]

Optics

Advanced Laser Leveling^[5]

What it is

The FC 150 is a flip-chip bonder. The machine is a flip-chip bonder.^[1]^[2]^[3]^[4]^[5]

How it works

Some units of the FC 150 include optional equipment such as a Chip Flipper, Automatic Alignment (Cognex 8000), Advanced Laser Leveling, a Universal Bonding Arm (UBA), a High Precision SET Reflow Arm (SRA), and a Force Sensor in Stage. Some units of the FC 150 include heating features such as a Heating UBA and a Heating Chuck. Some units of the FC 150 support Automatic Alignment and process recording.^[5]^[2]

What do the numbers mean?

Power & electrical4

Voltage: 220V, 60Hz^[3]
Voltage: 220 V^[6]
Frequency: 50 Hz^[6]
Electrical Requirements: 20 Amps, 220V, 60Hz^[3]

Vacuum & pumping7

100 kg Bond Pressure^[1]; 200 kg Bond Pressure^[2]; 50 KG bond pressure^[3]
Bond Pressure: 50 kg, 100 kg, 200 kg^[1]
Bond Pressure: 100 kg^[1]
Bond Pressure: 200 kg^[2]
Bond Pressure: 50 kg^[3]

Wafer handling5

Heating Chuck 100mm^[2]; 4” Chip and Substrate Cassettes^[2]
Heating Chuck Size: 100 mm^[2]
Chip and Substrate Cassettes: 4 inch^[2]
Cassette Size: 4 inch (100 mm)^[2]

Optics & imaging3

Advanced Laser Leveling^[5]
Advanced Laser Leveling: Optional^[5]
Optional: Advanced Laser Leveling: Available^[5]

Performance8

Automatic Alignment^[2]; Automatic Alignment (Cognex 8000)^[5]; High Precision SET Reflow Arm (SRA)^[5]
Automatic Alignment: Yes^[2]
Automatic Alignment (Cognex 8000): Optional^[5]
High Precision SET Reflow Arm (SRA): Optional^[5]
Automatic Alignment: Yes (Cognex 8000 on some units)^[2]
Optional: High Precision SET Reflow Arm (SRA): Available^[5]

Control & software1

This tool powers on, launches software and completes initialization process (tool reset)^[5]

Accurate?

Dimensions & facilities1

Heating UBA: 100 mm, 200 kg^[2]

Configuration & options15

Heating UBA 100mm 200Kg^[2]; Process Recording^[2]; 20Amps^[3]; Optional equipment installed:^[5]; Chip Flipper^[5]; Universal Bonding Arm (UBA)^[5]; Force Sensor in Stage^[5]
Universal Bonding Arm (UBA): 100 mm^[2]
Process Recording: Yes^[2]
Chip Flipper: Optional^[5]
Universal Bonding Arm (UBA): Optional^[5]
Force Sensor in Stage: Optional^[5]
Optional: Chip Flipper: Available^[5]
Optional: Universal Bonding Arm (UBA): Available^[5]
Optional: Force Sensor in Stage: Available^[5]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Configuration100 kg Bond Pressure^[1]
Configuration200 kg Bond Pressure^[2]
Configuration50 KG bond pressure^[3]
Voltage220V, 60Hz^[3]
Voltage220 V^[6]
Frequency50 Hz^[6]
Bond Pressure50 kg, 100 kg, 200 kg^[1]
Electrical Requirements20 Amps, 220V, 60Hz^[3]
Bond Pressure100 kg^[1]
Bond Pressure200 kg^[2]
Bond Pressure50 kg^[3]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

Does the FC 150 have automatic alignment?

The FC 150 can be equipped with automatic alignment using a Cognex 8000 system.^[2]^[5]

What optional equipment can be installed on the FC 150?

Optional equipment includes a chip flipper, automatic alignment, advanced laser leveling, a universal bonding arm, a high precision SET reflow arm, and a force sensor in the stage.^[5]

What are the electrical requirements for the FC 150?

The FC 150 has electrical requirements of 20 Amps at 220V, 60Hz.^[3]^[4]^[5]

Not publicly documented

The following facts about the FC 150 Flip Chip are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FC 150 Flip Chip are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the FC 150 Flip Chip are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the FC 150 Flip Chip are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FC 150 Flip Chip are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the FC 150 Flip Chip is not on record.
Answerable by: an OEM datasheet or a fab qualification report