Oxford Instruments
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The Oxford 800 Plus is explicitly designated as a plasma-enhanced chemical vapor deposition system. The system is rated for 50/60 Hz mains power.[1]
The 800 Plus employs pulsed high-frequency (HF) and low-frequency (LF) power mixing to control film stress. The ratio of HF to total power, expressed as percentage HF, determines whether the deposited film is compressive or tensile. The stress can be adjusted continuously from compressive to tensile by varying the HF pulse time.[2]
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| 80 Plus | — | — | Shorter cleaning interval due to frequent chamber venting; lower power deposition (<50 W) | nanolab.berkeley.edu[2] |
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The following facts about the 800 Plus are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 800 Plus are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 800 Plus are not on record.
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No publicly documented failure modes or field errata for the 800 Plus are on record.
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The process node or technology generation of the 800 Plus is not on record.
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No publicly documented compatible parts, consumables, or accessories for the 800 Plus are on record.
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Last updated Sep 25, 2026.
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