Lam Research
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The Lam / SEZ DV 34 BF uses plasma-based etching to remove material from the wafer surface.
The Lam / SEZ DV 34 BF sits in the etch step of the semiconductor fabrication process flow.
The Lam / SEZ DV 34 BF is typically used in a cleanroom environment for front-end-of-line or back-end-of-line etching steps.
The Lam / SEZ DV 34 BF is used for etching processes in semiconductor device manufacturing.
The Lam / SEZ DV 34 BF can be applied to dielectric or conductor etching depending on the process chemistry.
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The following facts about the SEZ DV 34 BF are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SEZ DV 34 BF are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SEZ DV 34 BF are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SEZ DV 34 BF are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SEZ DV 34 BF are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SEZ DV 34 BF is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 11, 2026.
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Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.