KLA
7600 Patterned Wafer Particle Defect
The KLA 7600 Patterned Wafer Particle Defect is a metrology and inspection system. The KLA 7600 Patterned Wafer Particle Defect is specified for a 25 Wafer Slot Cassette. The KLA 7600 Patterned Wafer Particle Defect includes cassette transfer, scan stage, wafer transfer, and boat elevator or robot transfer.[1][2]
Wafer size
25 Wafer Slot Cassette
Power
1 line of 208 Vac 15 Amp[1]
Vacuum
Exhaust with Blower for laser cooling[2]
What it is
How it works
The KLA 7600 scans wafers with a laser beam to detect particles and defects on patterned surfaces. The system employs an argon ion laser rated for 30 milliwatts as its light source, performing 104 laser scans per second. A scanning beam is directed across the wafer while the substrate moves at a forward speed of 2.6 mm/s.[3]
Particle sensitivity on the KLA 7600 is specified as 0.15 mm diameter latex spheres on both bare silicon and patterned process wafers. The spatial resolution is 50 mm minimum spacing between particles. The system can accept up to ±3.0° pattern rotation relative to the wafer flat or notch.[3]
Throughput for the KLA 7600 is 30 wafers per hour for 8-inch wafers under normal load-measure-unload cycles. Throughput is higher for smaller wafers when operating in high-throughput mode.[3]
What do the numbers mean?
Power & electrical1
Vacuum & pumping2
- Exhaust with Blower for laser cooling[2]
Wafer handling7
Configuration & options5
- Scan Stage[2]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What particle sensitivity does the KLA 7600 achieve?
The KLA 7600 can detect 0.15 mm diameter latex spheres on bare silicon and on patterned process wafers.[3]
What is the throughput of the KLA 7600?
The throughput is 30 wafers per hour for 8-inch wafers in normal load-measure-unload cycles.[3]
What type of laser does the KLA 7600 use?
The system uses an argon ion laser rated for 30 milliwatts.[3]
What is the scanning beam rate of the KLA 7600?
The system performs 104 laser scans per second.[3]
What is the spatial resolution for particles detected by the KLA 7600?
The minimum spacing between particles that can be resolved is 50 mm.[3]
Not publicly documented
The following facts about the 7600 Patterned Wafer Particle Defect are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7600 Patterned Wafer Particle Defect are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 7600 Patterned Wafer Particle Defect are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 7600 Patterned Wafer Particle Defect are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 7600 Patterned Wafer Particle Defect are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 7600 Patterned Wafer Particle Defect is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]waferpedia.com — waferpedia.comwaferpedia.com
- [2]Inventory photo
- [3]On Sale KLA / TENCOR SurfScan 7600 — plastemart.complastemart.com
Last updated Oct 10, 2026.
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