KLA
6200
Plate 01KLA-Tencor Surfscan 6200 Defect Inspection System (ID# 4418)
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Wafer size
25 Wafer Slot Cassette
Power
1 line of 208 Vac, 15 amp[1]
Vacuum
Exhaust with blower for laser cooling[1]
What it is
The KLA 6200 is configured for 6-inch wafers and includes a 25-wafer slot cassette, a wafer transfer mechanism, a scan stage, cassette transfer hardware, and a boat elevator with robot transfer. The system operates on 208 volt single-phase power and uses a vacuum level of 23 inches of mercury during processing. An exhaust with blower is provided for laser cooling.[1][2]
How it works
General reference — not yet source-verifiedA KLA inspection system scans a wafer using a focused laser beam and collects light scattered by defects. The scan stage moves the wafer in a controlled pattern under the optical head, and the detection optics convert the scattered light into electrical signals that are analyzed to locate and classify defects.
Where it fits in the process flow
General reference — not yet source-verifiedWafer inspection systems like the KLA 6200 are positioned in the fab after critical process steps such as lithography, etch, deposition, and chemical-mechanical planarization. The inspect step verifies that the preceding process was defect-free before the wafer moves to the next operation, preventing costly rework or scrapping of advanced material.
What do the numbers mean?
Power & electrical6
- Single Phase[2]
Vacuum & pumping3
- Exhaust with blower for laser cooling[1]
Wafer handling6
Configuration & options3
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Parts & consumables
Tracked replaceable assemblies, spares criticality, and availability status across all major subsystems. Each entry cites its source.
- KLA Surfscan 6200 SBC UpgradeIn Productionsource[3]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of defects can these inspection systems detect?General reference — not yet source-verified
Such tools can detect a wide range of physical and pattern defects: particles, scratches, stains, cracks, missing or bridging features, overlay errors, and trench depth variations. The exact sensitivity depends on the imaging technology and algorithm settings.
How does the inspection speed affect manufacturing throughput?General reference — not yet source-verified
Inspection throughput is a key specification; systems are designed to balance high sensitivity with wafer-per-hour rates suitable for production. The actual throughput depends on recipe complexity, die size, and required detection limits.
Can the same tool be used for both die-to-die and die-to-database inspection?General reference — not yet source-verified
Many modern inspection systems support multiple modes: die-to-die comparison for pattern wafers and die-to-database comparison for known-good references. Some also offer cell-to-cell and array mode for repetitive structures.
How are recipes created and optimized for a new product?General reference — not yet source-verified
Recipe creation involves defining inspection parameters such as illumination conditions, scanning pattern, resolution, defect threshold algorithms, and classification bins. Optimization is iterative, typically using test wafers with known defectivity to tune sensitivity while minimizing nuisance defect capture.
Not publicly documented
The following facts about the 6200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 6200 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 6200 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 6200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 6200 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 6200 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Equipment inventory listing
- [4]Equipment inventory listing
Last updated Sep 30, 2026.
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