EV Group
850 Debonder
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
A debonder separates processed temporary bonding wafer stacks after the device wafer has been supported during handling.[3]
The EVG 850 DB supports fragile device wafers through film frame mounting or through a thin wafer handler.[3]
The EVG 850 DB combines debonding with cleaning and recipe controlled automation.[3]
Where it fits in the process flow
Applications
What do the numbers mean?
Power & electrical4
- 50/60 Hz[2]
Wafer handling7
- Function
- Fully automated debonder for the separation and cleaning of processed temporary bonding wafer stacks[3]
- Reliable handling of thinned, bowed and warped wafers with and without topography[3]
- Automated cleaning of debonded wafer[3]
- Bridge tool capability for different substrate sizes[3]
Control & software2
Configuration & options5
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer diameter does the EVG 850 DB support?
The EVG 850 DB supports wafer diameter up to 300 mm and up to 12 inch film frame substrates.[3]
What functions are integrated into the EVG 850 DB?
The EVG 850 DB integrates debonding, cleaning, and unloading of thin wafers.[3]
What wafer support methods does the EVG 850 DB use?
The EVG 850 DB supports fragile device wafers through film frame mounting or through a thin wafer handler.[3]
Not publicly documented
The following facts about the 850 Debonder are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 850 Debonder are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 850 Debonder are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 850 Debonder are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 850 Debonder are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 850 Debonder is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]evgroup.com — evgroup.comevgroup.com
Last updated Oct 10, 2026.
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