Comparison ledger
EV Group 850 Debonder, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 850 DebonderEV Group | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | EV Group | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 850 | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Phase | 3 Phase[1] | — |
| Configuration | 50/60 Hz[1] | — |
| Manufacturer | EV Group[2] | — |
| Model | 850 Debonder[3] | — |
| Model designation | EVG®850 DB Automated Debonding System[2] | — |
| Function | Fully automated debonder for the separation and cleaning of processed temporary bonding wafer stacks[2] | — |
| Wafer diameter | Up to 300 mm[2] | — |
| Wafer size | 2, 3, 4, 5, 6, 8, 12 inch[3] | — |
| Electrical | 3 Phase[1] | — |
| Electrical frequency | 50/60 Hz[1] | — |
| Feature | Reliable handling of thinned, bowed and warped wafers with and without topography[2] | — |
| Wafer Size | — | 6 inch[4] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →