Waferpedia

EV Group

520

520 — Inventory photo
Fig. 01520Inventory photo[1]

Wafer size

Manual wafer load substrate bonder

Power

50 / 60 Hz[1]

Vacuum

High-vacuum capable bond chamber[1]

Performance

± 1,5 %[1]

What is it?

The EVG 520 is a manual wafer load substrate bonder with fusion, thermal compression, and anodic bonding capability.

What do the numbers mean?

Power & electrical3

50 / 60 Hz[1]
Accurate?
120 / 208 V[1]
Accurate?
Phase
3 Phase[1]
Accurate?

Vacuum & pumping4

High-vacuum capable bond chamber[1]
Accurate?
Vacuum Chuck
6"/150mm diameter chuck[1]
Accurate?
Turbo pump and controller[1]
Accurate?
Roughing pump[1]
Accurate?

Wafer handling2

Wafer size
Manual wafer load substrate bonder[1]
Accurate?
Wafer Size
up to 150 mm capable[1]
Accurate?

Performance1

Temperature uniformity
± 1,5 %[1]
Accurate?

Control & software1

Windows based control software and operation interface[1]
Accurate?

Configuration & options9

Refurbished[1]
Accurate?
Capable of fusion & thermal compression bonding[1]
Accurate?
Capable of anodic bonding[1]
Accurate?
Auto opening of bond tool cover[1]
Accurate?
Max Bond Force
7 kN[1]
Accurate?
Top Side Heater
550°C max. in 1°C steps[1]
Accurate?
Bottom Side Heater
550°C max. in 1°C steps[1]
Accurate?
Thermoflex 1400 Chiller (or equivalent)[1]
Accurate?
Load / unload tool[1]
Accurate?
Interested in this tool?
Need help with this tool?Embed spec card

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Configuration50 / 60 Hz[1]
  • Configuration120 / 208 V[1]
  • Phase3 Phase[1]
  • ConfigurationHigh-vacuum capable bond chamber[1]
  • Vacuum Chuck6"/150mm diameter chuck[1]
  • ConfigurationTurbo pump and controller[1]
  • ConfigurationRoughing pump[1]

Parts & consumables

Tracked replaceable assemblies, spares criticality, and availability status across all major subsystems. Each entry cites its source.

  • EVG 520 IS Manual Wafer Load Substrate BonderIn Productionsource[2]
  • EVG 520 Manual Wafer Load Substrate BonderIn Productionsource[3]
  • EVG 520 Manual Wafer Load Substrate BonderIn Productionsource[4]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Worked with this tool? Help preserve its knowledge →

Not publicly documented

The following facts about the 520 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 520 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 520 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 520 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 520 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 520 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]Equipment inventory listing
Was this page accurate?

Last updated Jul 29, 2026.

Compare with similar tools

View all →