Esec
Esec 2100 SSI
The Esec 2100 SSI is a die bonder. The Esec 2100 SSI supports epoxy die attach applications. The Esec 2100 SSI is specified for wafers from 4" to 12" on 8" or 12" wafer frames.[1]
Wafer size
4"
Performance
20 µm @ 3σ (15 µm option)[1]
What it is
The Esec 2100 SSI is a packaging and bonding machine for epoxy die attach and related assembly work.[1]
How it works
General reference — not yet source-verifiedA die bonder picks individual dies, positions them, and places them onto a package substrate or leadframe with controlled adhesive or bonding material handling.
The Esec 2100 SSI class of equipment supports automated placement, recipe-driven setup, vision-based alignment, and process monitoring during bonding operations.
Where it fits in the process flow
General reference — not yet source-verifiedThe Esec 2100 SSI sits in the backend assembly flow after wafer processing and before encapsulation, singulation, and final package completion.
The Esec 2100 SSI is used where dies must be attached to strips, leadframes, or substrates as part of semiconductor package assembly.
Applications
The Esec 2100 SSI is suited to epoxy die attach work.[1]
The Esec 2100 SSI supports packaging formats that include QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA, and LGA.[1]
- TSOP
- FBGA
What do the numbers mean?
Wafer handling1
Performance1
Dimensions & facilities2
Configuration & options3
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the Esec 2100 SSI are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Esec 2100 SSI are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Esec 2100 SSI are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Esec 2100 SSI are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Esec 2100 SSI are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Esec 2100 SSI is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
Last updated Oct 3, 2026.
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