Esec
Esec 2100 hS i
The Esec 2100 hS i is a die bonder. The Esec 2100 hS i is the 3rd generation of a 300 mm high speed platform. The Esec 2100 hS i is capable of epoxy die attach applications.[1]
Wafer size
4"
Performance
20 µm @ 3σ (15 µm option)[1]
What it is
The Esec 2100 hS i is a die bonder for packaging and bonding applications.[1]
How it works
Where it fits in the process flow
The Esec 2100 hS i is intended for high-speed epoxy die attach in packaging formats that include QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA, and LGA.[1]
What can it run?
Process applications and technology nodes documented for this tool.
- Epoxy die attach
- TSOP
- FBGA
What do the numbers mean?
Wafer handling2
Performance1
Dimensions & facilities2
Configuration & options4
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the Esec 2100 hS i are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Esec 2100 hS i are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Esec 2100 hS i are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Esec 2100 hS i are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Esec 2100 hS i are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Esec 2100 hS i is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
- [2]Inventory photo
- [3]Inventory photo
Last updated Oct 9, 2026.
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