Esec
E142 on Esec Die Bonder
Plate 01Esec Die Bond
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Wafer size
4"
Performance
20 µm @ 3σ (15 µm option)[1]
What it is
The Esec 2100 hS is a 300 mm high-speed die bonding platform, and the E142 is offered on that platform.[1]
How it works
Applications
The Esec 2100 hS is intended for epoxy die attach applications.[1]
The Esec 2100 hS is specified for QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA, and LGA packages.[1]
- Epoxy die attach
- TSOP
- FBGA
What do the numbers mean?
Wafer handling1
Performance1
Dimensions & facilities2
Configuration & options5
- E142 Strip Mapping (CSR required)[1]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Esec 2100 hS iXplus | — | — | — | besi.com[1] |
| Esec 2100 sD advanced i | — | — | — | besi.com[1] |
| Esec 2100 hS i | — | — | — | besi.com[1] |
| Esec 2100 hS | 3rd generation | — | Flexible 300 mm high speed platform for epoxy die attach applications. | besi.com[1] |
| Esec 2100 SC Strip Mapping | — | — | — | besi.com[1] |
| E142 on Esec Die Bonder | — | — | Strip mapping option; CSR required. | besi.com[1] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
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Not publicly documented
The following facts about the E142 on Esec Die Bonder are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the E142 on Esec Die Bonder are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the E142 on Esec Die Bonder are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the E142 on Esec Die Bonder are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the E142 on Esec Die Bonder is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the E142 on Esec Die Bonder are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
Last updated Oct 2, 2026.
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