Disco
DGP 8760 + DFM 2800
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Disco DGP 8760 + DFM 2800 is a fully automatic wafer grinding system. The Disco DGP 8760 + DFM 2800 supports 8-inch and 12-inch wafer sizes. The Disco DGP 8760 + DFM 2800 includes an inline UV irradiation system.[1]
What it is
How it works
General reference — not yet source-verifiedA dicing and grinding system separates processed wafers into individual dies and reduces wafer thickness by controlled material removal.
A grinding stage typically works by bringing the wafer into contact with an abrasive surface under controlled motion and pressure.
Where it fits in the process flow
The Disco DGP 8760 + DFM 2800 can be configured as a stand-alone back grinding system or used inline with a wafer mounter.[1]
Applications
The Disco DGP 8760 + DFM 2800 has an inline ultraviolet irradiation system, pre-cut dicing tape, and a finish thickness of up to 50 um with wafer polishing.[1]
What do the numbers mean?
Power & electrical1
Wafer handling5
- Stand-alone BG or In-line with wafer mounter[1]
Configuration & options7
- Fully automatic[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Power200 Vac, 3 Phase[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes does the Disco DGP 8760 + DFM 2800 support?
The Disco DGP 8760 + DFM 2800 supports 8 inch and 12 inch wafers.[1]
Can the Disco DGP 8760 + DFM 2800 operate as a stand-alone system?
The Disco DGP 8760 + DFM 2800 can be configured as a stand-alone back grinding system.[1]
Can the Disco DGP 8760 + DFM 2800 be used inline with other equipment?
The Disco DGP 8760 + DFM 2800 can be configured inline with a wafer mounter.[1]
Not publicly documented
The following facts about the DGP 8760 + DFM 2800 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DGP 8760 + DFM 2800 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DGP 8760 + DFM 2800 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DGP 8760 + DFM 2800 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DGP 8760 + DFM 2800 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DGP 8760 + DFM 2800 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Inventory photo
Last updated Oct 10, 2026.
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