Comparison ledger
Disco DGP 8760 + DFM 2800, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DGP 8760 + DFM 2800Disco | 15Lapmaster |
|---|---|---|
| OEM | Disco | Lapmaster |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DGP 8760 | Lapmaster 15 |
| Specifications | ||
| Configuration | Fully automatic[1] | — |
| Wafer Sizes | 8, 12 inch[1] | — |
| Fully automatic | Yes[1] | — |
| Power | 200 Vac, 3 Phase[1] | — |
| Inline UV irradiation system | Present[1] | — |
| Pre-Cut Dicing Tape | Yes[1] | — |
| Finish thickness min with wafer polishing | Up to 50ums[1] | — |
| Minimum finish thickness with wafer polishing | 50 µm[1] | — |
| Operation type | Fully automatic[1] | — |
| Configuration options | Stand-alone BG or in-line with wafer mounter[1] | — |
| Vintage year | 2009[1] | — |
| Input Power | — | 110 Vac[2] |
| Plate Diameter | — | 15 inches (381 mm)[3] |
| Number of Conditioning Rings | — | 3[3] |
| Ring ID | — | 5.5 inches (140 mm)[3] |
| Standard RPM | — | 60[3] |
| RPM Range (Variable Speed Drive) | — | 0-60[3] |
| Drive Motor - Lapper | — | 0.5 HP (0.37 kW)[3] |
| Drive Motor - Polisher | — | 0.75 HP (0.56 kW)[3] |
| Length | — | 25 inches (635 mm)[3] |
| Width | — | 20 inches (508 mm)[3] |
| Height | — | 24 inches (610 mm)[3] |
| Estimated Shipping Weight | — | 285 lbs (129.3 kg)[3] |
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