CHA
Solution E-Beam
The CHA Solution E-Beam Evaporator is a small-scale vacuum deposition system designed for small lot processing and engineered to handle a wide range of deposition needs. The CHA Solution E-Beam Evaporator performs electron beam (E-Beam) thin metal film evaporation from up to 4 independent sources. The CHA Solution E-Beam Evaporator features a fully water cooled stainless steel chamber and a SmartSource electron beam gun.[1][2]
What it is
Where it fits in the process flow
General reference — not yet source-verifiedElectron beam evaporators are used in semiconductor and MEMS fabrication for depositing thin metal films. The CHA Solution is typically used after substrate cleaning and before photolithography or as part of a metallization step. Upstream processes include wafer cleaning and surface preparation. Downstream processes may include lift-off or etching.
Applications
General reference — not yet source-verifiedThe system is used for depositing thin films of metals and dielectrics for applications such as contact metallization, interconnects, and optical coatings.
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Glassman power supply PS/LQ10N1.00GB4 has an issue
What do the numbers mean?
Power & electrical8
Wafer handling2
- Substrate holder
- Dome for holding 2 inch and/or 3 inch back loaded substrates positioned 90 degrees to the source; Dome for two 6 x 6 inch square back loaded substrates positioned 90 degrees to the source[1]
Optics & imaging1
- Electron beam gun
- SmartSource electron beam gun with motor driven crucible rotation and lift lid[1]
Control & software2
Configuration & options9
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Voltage220 VAC[3]
- Phase3 Phase[3]
- Frequency60 Hz[3]
- Configuration100 Amps[3]
- ConfigurationGlassman power supply PS/LQ10N1.00GB4 has an issue[3]
- Deposition controllerMaxtek rate and thickness deposition controller integrated for control of shutter and electron beam power supply[1]
- Electrical requirements220 VAC, 3 Phase, 60 Hz, 5 Wire, 100 Amps[3]
- Power supplyGlassman PS/LQ10N1.00GB4 (noted issue)[3]
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- EVAP1_operating _procedure_r5.pdfDocumentduke.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the chamber volume?
The chamber volume is 4.5 cubic feet.[1]
What type of automation does the CHA Solution use?
The system is controlled by PLC automation with a touchscreen interface.[1][4]
What substrate sizes can the system accommodate?
The system includes domed holders for 2-inch and 3-inch back loaded substrates, as well as a dome for two 6 x 6 inch square back loaded substrates.[1]
What materials can be deposited with the CHA Solution?
Materials available include Ti, Cr, Ni, NiFe, Al, Au, Ag, Pt, Cu, Nb, Gd, Co, Ge, Sn, W, Fe, TiN, Ta, SiO2, NiO, TiO2, Al2O3, and HfO2.[4]
Not publicly documented
The following facts about the Solution E-Beam are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Solution E-Beam are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Solution E-Beam are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Solution E-Beam are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the Solution E-Beam is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Solution E-Beam are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]smif.pratt.duke.edu — smif.pratt.duke.edusmif.pratt.duke.edu
- [2]Physical Vapor Deposition — nanolab.berkeley.edunanolab.berkeley.edu
- [3]Inventory photo
- [4]nanolab.ucla.edu — nanolab.ucla.edunanolab.ucla.edu
- [5]Film Formation — tudelft.nltudelft.nl
Last updated Sep 29, 2026.
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