Applied Materials
Centura 5200 DPS
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
Produced
1995–
Power
50/60 Hz[1]
What it is
General reference — not yet source-verifiedThe Centura 5200 DPS belongs to the class of plasma etchers used to remove selected material from patterned wafers. Plasma etch tools sit in the middle of wafer fabrication after pattern definition and before later film or device integration steps.
How it works
General reference — not yet source-verifiedA decoupled plasma source etch system generates plasma separately from the wafer bias that drives ion energy at the surface. The separated control of plasma density and wafer bombardment lets the tool balance etch rate, profile control, and selectivity for patterned structures.
An etch chamber exposes the wafer to reactive species that remove material from open areas while patterned masking layers protect intended features. Multi-chamber etch platforms support repeated process cycles within a common tool frame.
Where it fits in the process flow
General reference — not yet source-verifiedThe Centura 5200 DPS is used after lithography has defined the pattern to be transferred into a film or substrate layer. The tool removes exposed material and leaves the masked regions in place.
Applications
General reference — not yet source-verifiedA plasma etch tool of this class is used for pattern transfer, feature opening, and selective film removal in semiconductor manufacturing.
What do the numbers mean?
Vintage & configurations
- 1995Production start[1]
1995 vintage indicates production or introduction year.
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What process type does the model name indicate?
The model name indicates a Decoupled Plasma Source etch system.[1]
Not publicly documented
The following facts about the Centura 5200 DPS are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the Centura 5200 DPS are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Centura 5200 DPS are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Centura 5200 DPS are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Centura 5200 DPS is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Centura 5200 DPS are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
Last updated Oct 10, 2026.
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