Applied Materials
8100 X
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Applied Materials 8100 X is an etcher. The Applied Materials 8100 X is configured for 4 inch wafers.[1][2]
What it is
How it works
General reference — not yet source-verifiedPlasma etch tools generate a plasma from a process gas by applying radio-frequency power to a low-pressure chamber. Reactive species and ions from the plasma interact with exposed wafer material to form volatile products that are pumped away. The 8100 X, as an etch tool, follows this general plasma-based material-removal principle. Process gas composition, chamber pressure, and power are adjusted to control etch rate and profile.
Where it fits in the process flow
General reference — not yet source-verifiedEtch is a core pattern-transfer step in semiconductor manufacturing. After a lithographic mask is formed on a wafer, an etcher removes material from unmasked areas. The 8100 X would be used at this stage of the process flow. Following the etch step, remaining mask material is stripped and the wafer moves on to subsequent processing.
Applications
General reference — not yet source-verifiedEtch tools are used to define features in the materials that make up semiconductor devices. Common applications include etching silicon, dielectrics, and metals. The 8100 X, as an etch tool, would be suited to these material-removal operations. The same equipment class also supports applications such as contact hole formation and pattern transfer for interconnects.
What do the numbers mean?
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 8100 X are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the 8100 X are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 8100 X are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 8100 X are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 8100 X are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 8100 X are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 1, 2026.
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