ASML

The ASML PAS 5500/60 is a sub-half-micron i-line stepper for 200 mm wafers with 450 nm resolution.

The ASML PAS 5500/850 D is a scanner for 6-inch wafers, using a Cymer ELS-6610 light source and supporting R type, 1.2 mm notch and flat wafers.

The ASML Twinscan XT 1700 i Immersion Scanner is a 193nm immersion lithography system described as being used for volume chip production at 45nm mode.

The ASML PAS 5500/350C is a DUV stepper for photolithography, typically used in a cluster with a TEL Clean Track ACT-8 coater/developer for 100 mm wafers. The system dates from 1997.

The ASML PAS 5500 275 i-Line is an i-line stepper for 8 inch wafers.

ASML PAS 5500 / 300 C is a DUV stepper described as a deep ultraviolet lithography system.

The ASML Twinscan NXT 1980 i is a 12-inch wafer lithography scanner that was upgraded from the 1970i model.

ASML PAS 5000 / 55 A is a stepper identified with an option set that includes Wafer Tilt Monitor.

The ASML XT 1250 D is a lithography scanner.

The ASML Twinscan XT 400 F is an i-line scanner for 300 mm wafers.

The ASML PAS 5500 / 700 is a Scanner and a Stepper.

The ASML Twinscan 1200 B is a lithography scanner equipped with a Cymer XLA 160 laser, but it is non-operational due to an internal water leak near the lens and has no lens data available.

The ASML PAS 5500/400 is an i-line stepper for 8-inch wafers with a resolution of 280nm, introduced around 2002.

The PAS 2500 series was the first lithography system developed entirely by ASML and became the system that built the company.

The ASML TWINSCAN NXE:3400B is an extreme ultraviolet (EUV) lithography scanner designed for volume production at the 7 and 5 nm nodes.

The ASML Twinscan AT 850 D is a semiconductor manufacturing tool offered with a Cymer ELS 7600 or ELS 6610 laser and a Tel Lithius track.

The PAS 2400 is an early photolithography system from ASML that was demonstrated in 1985 and achieved a throughput of 90 wafers per hour.

ASML Twinscan XT 1950 Hi is a scanner for 12-inch wafers used for 193 nm immersion lithography with 38 nm resolution capacity.

The TWINSCAN EXE:5200B is a dual-stage extreme ultraviolet (EUV) lithography system designed to support volume production of sub-2 nm Logic nodes and leading-edge DRAM nodes.

The TWINSCAN NXE:3800E is a dual-stage EUV lithography system designed by ASML for high-volume manufacturing of advanced Logic and Memory chips.

The TWINSCAN NXE:3600D is an EUV lithography system for high-volume production of advanced Logic and DRAM chips.

The TWINSCAN NXE:3400C is an EUV lithography system by ASML that supports volume production at the 7 and 5 nm logic nodes.

The TWINSCAN NXE:3100 is a pre-production extreme ultraviolet (EUV) lithography system first shipped in 2010.

The TWINSCAN NXE:3300 was the first EUV production system, shipped in 2013.

ASML model 4022.480.0062 is a Vacuum Stage described as an air vacuum puck in good working condition.

The ASML TWINSCAN EXE:5000 is a dual-stage extreme ultraviolet (EUV) lithography system that uses a 13.5 nm light source and a numerical aperture of 0.55 to achieve 8 nm resolution.

The ASML PAS 5500/22 is a stepper used in semiconductor lithography.

The ASML 300 C is a model of equipment manufactured by ASML.

The ASML PAS 5500/300 DUV is a deep ultraviolet (DUV) stepper.

The ASML PAS 5500 / 100 C is a stepper system from 1995.

The ASML PAS 5500/300 C is a DUV stepper with a 248 nm exposure wavelength and 8 inch wafer support.

The ASML Twinscan XT 1250 D is a dry wafer scanner featuring a dual chuck wafer stage and a Cymer XLA165 light source.

The ASML PAS 5500/200 is an i-Line stepper for semiconductor lithography.

ASML model 4022.631.1584 is an Optical Gas Analyzer.

The Twinscan NXT 2050 i is a high-productivity deep ultraviolet immersion lithography system for advanced logic and memory nodes.

The ASML Twinscan AT 1100 is a 193 nm ArF laser-based lithography scanner that processes 200 mm and 300 mm wafers using dual-wafer stage technology.

The ASML YieldStar S 1375 F is an overlay measurement system for 12-inch wafers.

The ASML YieldStar S 100 B is an overlay measurement system that processes 12-inch wafers.

The ASML Twinscan 1950 i is an immersion scanner used in semiconductor lithography.

The ASML 5000 / 55 B is a stepper that supports 6-inch wafers.

The ASML Twinscan XT 1400 F Scanner is a 193nm (ArF) lithography scanner stated to handle 12-inch wafers.

The ASML URS 5000 / 55 B is a stepper that supports 6-inch wafers.

The ASML PAS 5500/275D is a high-throughput i-line stepper with 5X reduction, 365 nm exposure, and automated wafer handling for substrates up to 200 mm diameter.

The ASML ESC 320 RDA is a semiconductor manufacturing equipment item manufactured by ASML.

The PAS 5500/100 is a step-and-repeat i-line lithography system from ASML, introduced for 0.40 micron production.

The ASML 2500 / 40 is a stepper with a wafer table, reticle table, P-table, dipod, HP laser, and alignment laser.

The ASML YieldStar S 100 is an overlay measurement tool.

The ASML 4022.634.34071 PAAC 325/14 R PPCA is a new, sealed Power Mod (SERV.634.34071) cleanroom product from 2018.

The PAS 5500/100 is a step-and-repeat i-line lithography system from ASML introduced for 0.40 micron production.