Waferpedia

Tool family

SUSS MicroTec XB8

SUSS MicroTecPackaging & Bonding1 entry

The SUSS MicroTec XB8 is a semi-automated wafer bonding system for substrates up to 200 mm, supporting high-force wafer bonding.

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Models in this family

  1. XB8

    The SUSS MicroTec XB8 is a semi-automated wafer bonding system for substrates up to 200 mm, supporting high-force wafer bonding.