Tool family
Besi 2009 SSI E Die Bonder.
The Besi / Datacon 2009 SSI E is a die bonder described as a soft solder wire dispense system with a single wafer loader and magazine-to-magazine handling.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| 2009 SSI E | — | 2014 | — | Equipment inventory listing[1] |