Besi

The Besi / Datacon Fico MMS X is a molding machine used in semiconductor packaging and bonding.

The Besi Esec 2100 FC is a flip chip die bonder capable of 8 µm placement accuracy and up to 16,000 UPH.

The Besi / Datacon 2200 EVO Multi-Chip is a dual-head die sorter.

The Besi / Datacon 2220 EVO is a multi-chip die bonder with an accuracy of ±10 µm at 3 sigma.

The Datacon 2200 evo advanced is a multi-chip die bonder offering ±3 µm placement accuracy and up to 7,000 UPH throughput for mass production applications.

The Besi / Datacon 2200 EVO is a die bonder hybrid.

The Besi 2200 EVO Tool Holder is a tool holder component for the Datacon 2200 EVO die bonder.

The Besi / Datacon 2009 SSI E is a die bonder described as a soft solder wire dispense system with a single wafer loader and magazine-to-magazine handling.

The Besi DS 9000 is a die sorter manufactured by Besi (Datacon).

The Besi DS 9000 E C-C is a die sorter from Besi (formerly Datacon).

The Besi Datacon 2200 EVO is a high-accuracy multi-chip die bonder for die attach and flip chip applications.

General referenceThe Besi 2100 FC Plus is a flip chip bonding system used in semiconductor packaging for attaching dies to substrates via solder bumps.

The Besi / Esec 2100 FC hS is a die bonder with flip chip capability.

The Besi 2200 EVO Plus Die Bonder Hybrid is a hybrid die bonder manufactured by Besi / Datacon.

The Besi / Datacon 2200 APM is a die attach / flip chip machine.

The Besi 2200 EVO Flexible Multi-Chip is a packaging and bonding die bonder configured with a wafer table.

The Besi 2200 EVO Plus is a die bonder for multi module attach and die attach or flip chip applications.

The Besi / Datacon DS 9000 E is a bonder with an 8-inch wafer size and 208 VAC single-phase, 50/60 Hz power specifications.

The Besi / Datacon DC 2200 EVO is a single-head die bonder.

The Besi / Datacon 2200 APM+ is a die attach machine.