8"

The KLA Inspex Eagle Tester is a wafer handling and inspection system with 6-inch chuck and prealigner, 4-inch to 8-inch wafer capability, cassette-to-cassette handling, two ports, and a Zeiss microscope.

Oxford Instruments Plasmalab 80 Plus RIE is a reactive ion etcher with support for wafers up to 8 inches.

Tokyo Electron NS 300 + Wafer Scrubber is a wet-process wafer scrubber for 8-inch wafers.

The Axcelis NV GSD HE is an ion implantation system that can handle 6-inch and 8-inch wafers.

The Filmetrics F50-UV is a thin-film metrology tool that measures film thickness via spectroscopic reflectometry and can generate thickness uniformity maps.

ASM Siplace CA 4 Wafer is an 8-inch wafer system described as a high-volume chip assembly and 4-portal microchip/SMD hybrid assembly system.

The Axcelis VHE is an ion implanter described as a 6"-8" wafer convertible system.

The Denton Vacuum 635 is a sputter deposition tool with four confocal cathodes, an 8-inch diameter stage, and configurable DC, RF, and reactive sputtering capabilities.

The ASM AD 838 is an 8-inch-wafer die bonder with epoxy dispensing and no stack input, operating on single-phase 220 Vac at 50/60 Hz.

The Disco KR15 is a 200-micron-thick, low-grit dicing blade used for cutting sapphire, glass, and silicon samples.

Lam Research Rainbow 4520 is a single-wafer plasma/RIE etching system described as part of the Rainbow 45XX series.

The Laurell WS-650Mz-8NPPB is a spin coater that can take up to 8 inch wafers and go up to 10000 rpm.

The Esec 2100 HS is a die bonder for epoxy die attach applications.

The Lam Research 2300 is an etch platform in Lam's 2300 series, available as a 2300 Etch Chamber system with 8-inch and 12-inch wafer support.

The Ontrak DSS 200 is a semiconductor manufacturing system that processes 8-inch wafers.