YES
PB8
Plate 01Yield Engineering YES-PB8-2HV-US Polyimide Bake Oven (ID# 4964)
ClassOneEngineeringWatch on YouTubePlate 02Yield Engineering YES 450-PB8-2P-CP Polymid Bake Oven (ID# 4255)
ClassOneEngineeringWatch on YouTube
Wafer size
Up to 8-inch wafers
Vacuum
High vacuum (10^-5)[1]
What it is
The YES PB8 is a high temperature vacuum oven used for curing polyimide, SU8, BCB, and other films.[2]
How it works
Where it fits in the process flow
General reference — not yet source-verifiedThe YES PB8 is used after deposition or coating steps when films require thermal cure or stabilization before later fabrication steps.
Applications
The YES PB8 is used for curing polyimide, SU8, BCB, and other films.[2]
The YES PB8 can be used with non-toxic and non-flammable gases and materials only.[2]
- Curing polyimide
- Curing SU8
- Curing BCB
- Curing other films
- Wafer dehydration
- Getter activation
- Metal annealing
- Thermal treatment of thin film resistors
Why won't it start?
Documented failure modes, common issues, and field considerations.
- No low-temperature materials (unstable below 500C)
- No high-vapor-pressure materials
- Non-toxic and non-flammable gases/materials only
What do the numbers mean?
Vacuum & pumping5
- Compatibility
- 4 - Glass and Metal; no low-temperature materials unstable below 500C; no high-vapor-pressure materials; non-toxic and non-flammable gases/materials only[2]
Wafer handling3
Gas & chemistry1
Configuration & options7
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| YES-PB8 High Vac | — | — | Described as the PB8 high vacuum oven, with high vacuum specs listed for up to 200mm wafers. | web.archive.org[1] |
| YES-PB8 High Vac Specs | — | — | Listed as the PB8 high-vacuum configuration; source notes up to 200mm wafers. | web.archive.org[1] |
| PB12 | — | — | Up to 300mm wafers | web.archive.org[1] |
What replaced it?
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Gas/material compatibilityNon-toxic and non-flammable gases/materials only[2]
- Vacuum levelHigh vacuum; tool overview states 10^-5 Torr[1]
- Compatibility4 - Glass and Metal; no low-temperature materials unstable below 500C; no high-vapor-pressure materials; non-toxic and non-flammable gases/materials only[2]
- Series vacuum levelHigh vacuum (10^-5)[1]
- Laminar flow pressure range0.50-500 Torr[1]
- Evacuation capabilityDown to 1E-5 Torr using a vacuum turbo pump[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of processes can be performed on a diffusion furnace of this class?General reference — not yet source-verified
Such systems typically handle thermal diffusion, oxidation, annealing, and sometimes LPCVD processes, depending on the specific configuration.
How are wafers loaded into the furnace?General reference — not yet source-verified
Wafers are usually placed in a quartz boat and loaded horizontally into a heated tube using an automated transfer system to ensure uniform heating and minimal contamination.
What are common temperature ranges for these thermal processors?General reference — not yet source-verified
Diffusion furnaces typically operate from several hundred degrees Celsius to over a thousand degrees Celsius, depending on the process requirements, though exact numbers vary.
Is this system suitable for high-volume manufacturing?General reference — not yet source-verified
Yes, batch-type furnaces of this class are designed for high throughput, processing dozens of wafers per run, making them common in volume production.
What safety features are typical for such equipment?General reference — not yet source-verified
Systems generally include interlocked gas cabinets, exhaust monitoring, temperature over-limit protection, and emergency shutdown capabilities to handle hazardous gases and high temperatures.
Not publicly documented
The following facts about the PB8 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the PB8 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the PB8 are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the PB8 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the PB8 are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the PB8 are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]cnfusers.cornell.edu — cnfusers.cornell.educnfusers.cornell.edu
- [3]Equipment Resources | CNF — cnf.cornell.educnf.cornell.edu
Last updated Oct 5, 2026.
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