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West Bond

7700C

Packaging & BondingWest Bond 7700C family
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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The West-Bond 7700C is a thermosonic ball-wedge wire bonder. The West-Bond 7700C is a manual wire bonder. The West-Bond 7700C uses a thermosonic bonding process.[1]

West Bond7700C
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What it is

The West Bond 7700C is a thermosonic ball-wedge wire bonder.[1]

How it works

General reference — not yet source-verified

The bonder is equipped with a heated workholder that holds the substrate or package at a controlled temperature during bonding. The operator guides the bonding tool using a joystick and observes the process through a microscope with coaxial illumination.

Applications

General reference — not yet source-verified

Thermosonic ball-wedge bonding is commonly used for gold wire in standard IC packaging, such as plastic-encapsulated packages, and is also applied in optoelectronics, MEMS, and power device packaging where fine-pitch or deep-access bonding is required.

What do the numbers mean?

Configuration & options1

bond type
thermosonic ball-wedge[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
7700A———semistarcorp.com[1]
7700B———semistarcorp.com[1]
7700E———semistarcorp.com[1]
7700E-79———semistarcorp.com[1]
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the 7700C are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • Fewer than 3 independently cited specifications for the 7700C are on record; the remainder await public documentation.

    Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7700C are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the 7700C are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 7700C are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 7700C is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]semistarcorp.com — semistarcorp.comsemistarcorp.com
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Last updated Oct 3, 2026.

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