West Bond
The West Bond 7367E is a manual dual-head die bonder. The West Bond 7367E uses gantry construction and orthogonal motions rather than pivoted motion. The West Bond 7367E includes ESD protection.[1]
A dual-head die bonder uses the heads alternately to pick up chips, rotate them, place them, and bond them.[1]
The West Bond 7367E uses a gantry construction with orthogonal motion rather than pivoted motion.[1]
The West Bond 7367E uses a three-axis micromanipulator with the machine mechanism arranged above the work plane.[1]
The West Bond 7367E is used for chip pick-up, placement, and bonding in package assembly.[1]
The West Bond 7367E includes ESD protection.[1]
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The following facts about the 7367E are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7367E are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 7367E are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 7367E are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 7367E are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 7367E is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 2, 2026.
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