Waferpedia

West Bond

4546E

Packaging & BondingWest Bond 4546E family
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The West Bond 4546E is a semi-automatic wedge wire bonder. The West Bond 4546E uses ultrasonic energy to bond wire leads between wafer dies and contact pads of electronic packages. The West Bond 4546E is typically configured for 1 mil (25 μm) Al wire in a wedge bonding configuration.[1][2][3]

West Bond4546E
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  • Plate 014546E-79

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    West Bond Inc.Watch on YouTube
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Power

5 W, 63 kHz[1]

Optics

look down camera and screen[1]

What it is

The West Bond 4546E is a semi-automatic wedge wire bonder used for making electrical contacts between semiconductor dies and packages.[1][2][3]

How it works

The West Bond 4546E uses ultrasonic energy to bond wire leads between wafer dies and contact pads of electronic packages.[1][2][4]

The West Bond 4546E has microprocessor controllable motion in the Z and Y axes.[1][2][4]

Where it fits in the process flow

The West Bond 4546E is used when a packaged device needs electrical interconnection between semiconductor dies and package contact pads.[1][2][3]

Applications

The West Bond 4546E is used in semiconductor packaging and bonding applications.[2][3]

  • making electrical contacts between semiconductor dies and packages

What do the numbers mean?

Power & electrical1

Transducer
5 W, 63 kHz[1]
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Optics & imaging1

Bond placement aid
look down camera and screen[1]
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Control & software3

Motion control
microprocessor controllable motion in Z and Y axes[1]
Accurate?
Bonding control
programmable bonding steps for repeatable wire profile control[1]
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Programming
programmable bonding steps for repeatable wire profile control[1]
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Configuration & options7

Vendor
West-Bond Inc.[1]
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Model
4546E[1]
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Tool type
semi-automatic wedge bond tool[1]2 sources
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Bonding method
uses ultrasonic energy[1]2 sources
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Typical wire configuration
1 mil (25 μm) Al wire (wedge bonding configuration)[1]
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Convertible bonding modes
45° wedge and 90° (deep access) wedge bonding[1]
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Wire compatibility
Al and Au wires from 0.7 mil to 2 mil in diameter for room temperature thermosonic bonding[1]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Transducer5 W, 63 kHz[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What type of machine is the West Bond 4546E?

The West Bond 4546E is a semi-automatic wedge wire bonder.[2][3]

What is the West Bond 4546E used for?

The West Bond 4546E is used for making electrical contacts between semiconductor dies and packages.[1][2][3]

What bonding method does the West Bond 4546E use?

The West Bond 4546E uses ultrasonic energy to bond wire leads between wafer dies and contact pads of electronic packages.[1][2][4]

What motion control does the West Bond 4546E have?

The West Bond 4546E has microprocessor controllable motion in the Z and Y axes.[1][2][4]

What wire configuration is typically used with the West Bond 4546E?

The West Bond 4546E is typically configured for 1 mil aluminum wire in wedge bonding configuration.[1][2]

Not publicly documented

The following facts about the 4546E are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 4546E are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 4546E are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 4546E are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 4546E are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 4546E is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]uwaterloo.ca — uwaterloo.cauwaterloo.ca
  2. [2]4546E — West Bond | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
  3. [3]West Bond 4546E family | Waferpedia — waferpedia.comwaferpedia.com
  4. [4]WestBond 4546E - Alltek Company — alltekusa.comalltekusa.com
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Last updated Oct 3, 2026.

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