Waferpedia

Towa

PMC 1040 S

Packaging & BondingTowa PMC 1040 S family
Research Quality: 30% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

TowaPMC 1040 S
No photo available yet

What it is

General reference — not yet source-verified

The Towa PMC 1040 S is a compression molding system used in semiconductor packaging. Compression molding systems encapsulate semiconductor devices in a protective resin using heat and pressure.

How it works

General reference — not yet source-verified

In compression molding, a preheated resin pellet or liquid resin is placed in a mold cavity. The mold is closed under pressure, causing the resin to flow around the semiconductor device. The resin then cures, forming a protective encapsulation. Compression molding differs from transfer molding in that the mold is closed completely and the resin flows under low pressure.

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • Non-operational

What do the numbers mean?

Configuration & options4

Non-operational[1]
Accurate?
Workpiece size compatibility
100mm x 300mm[2]
Accurate?
Structure
Single-layer structure, press mechanism with hold frame structure[2]
Accurate?
Technology
Proprietary compression technologies, modular concept[2]
Accurate?

Vintage & configurations

  1. 2009Vintage[1]

    Source describes the equipment as 2009 vintage.

Interested in this tool?
Need help with this tool?Embed spec card

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Worked with this tool? Help preserve its knowledge →

Frequently asked questions

What workpiece size does the PMC 1040 S support?

The PMC 1040 S is compatible with 100 x 300 mm workpieces.[2]

What type of press mechanism does the PMC 1040 S use?

The PMC 1040 S uses a press mechanism with a hold frame structure.[2]

What is the PMC 1040 S capable of molding?

The PMC 1040 S is capable of molding large frames and substrates in bulk.[2]

What molding challenge does the PMC 1040 S address?

The PMC 1040 S is optimal for preventing wire flow of long wires.[2]

How does the PMC 1040 S use resin?

The PMC 1040 S has a higher effective utilization ratio of resins.[2]

Is the PMC 1040 S environmentally friendly?

Yes, the PMC 1040 S generates no waste.[2]

Not publicly documented

The following facts about the PMC 1040 S are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented variants, configuration options, or revision breakpoints of the PMC 1040 S are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the PMC 1040 S are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the PMC 1040 S is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the PMC 1040 S are on record.

    Answerable by: an OEM parts catalog or a service engineer

  • No publicly hosted manuals, SOPs, or datasheets for the PMC 1040 S are on record.

    Answerable by: university cleanroom staff or an OEM application specialist

Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]web.archive.org — towajapan.co.jp (Jan 19, 2026)web.archive.org
Was this page accurate?

Last updated Sep 30, 2026.

Compare with similar tools

View all →