Towa
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The Towa PMC 1040 S is a compression molding system used in semiconductor packaging. Compression molding systems encapsulate semiconductor devices in a protective resin using heat and pressure.
In compression molding, a preheated resin pellet or liquid resin is placed in a mold cavity. The mold is closed under pressure, causing the resin to flow around the semiconductor device. The resin then cures, forming a protective encapsulation. Compression molding differs from transfer molding in that the mold is closed completely and the resin flows under low pressure.
Documented failure modes, common issues, and field considerations.
Source describes the equipment as 2009 vintage.
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The PMC 1040 S is compatible with 100 x 300 mm workpieces.[2]
The PMC 1040 S uses a press mechanism with a hold frame structure.[2]
The PMC 1040 S is capable of molding large frames and substrates in bulk.[2]
The PMC 1040 S is optimal for preventing wire flow of long wires.[2]
The PMC 1040 S has a higher effective utilization ratio of resins.[2]
Yes, the PMC 1040 S generates no waste.[2]
The following facts about the PMC 1040 S are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the PMC 1040 S are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the PMC 1040 S are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the PMC 1040 S is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the PMC 1040 S are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the PMC 1040 S are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Last updated Sep 30, 2026.
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