Waferpedia

Tokyo Electron

P 12

Test & ProbeTokyo Electron P 12 family
Research Quality: 50% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

P 12 — Inventory photo
Fig. 01P 12Inventory photo[1]

What it is

General reference — not yet source-verified

The Tokyo Electron P 12 is an automatic wafer prober used in semiconductor test and measurement. Probers make temporary electrical contact to the circuits on a wafer so that parametric or functional tests can be performed before the wafer is diced and packaged.

How it works

General reference — not yet source-verified

A wafer prober uses a precision motorized stage to position a wafer under a probe card. The probe card contains many fine needles that align with the bond pads of individual die on the wafer. The prober brings the wafer up to contact the probe needles, then steps from die to die, making contact at each site so that a tester can apply signals and measure responses.

The P 12 is an automatic prober, meaning it loads, aligns, and steps through wafers under computer control without manual intervention for each die.

Where it fits in the process flow

General reference — not yet source-verified

Wafer probers sit in the test and sort step of semiconductor manufacturing, after wafer fabrication and before dicing and packaging. Electrical tests performed on the prober allow defective die to be identified and marked for discard, improving final yield.

The prober is used in conjunction with an automatic test equipment (ATE) system. The prober handles wafer transport and alignment while the ATE performs the actual measurements.

Applications

General reference — not yet source-verified

The Tokyo Electron P 12 is employed in semiconductor foundries, integrated device manufacturers, and test houses for production wafer sort and engineering characterisation.

What do the numbers mean?

Configuration & options3

Powers ON but cannot complete initialization[2]
Accurate?
Does not power on[3]
Accurate?
Display driver board malfunctioning[4]
Accurate?
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Parts & consumables

Tracked replaceable assemblies, spares criticality, and availability status across all major subsystems. Each entry cites its source.

  • Tel P 8, P 12 BoardIn Productionsource[5]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What is the primary purpose of an automated wafer prober?General reference — not yet source-verified

The primary purpose is to make temporary electrical contact with each die on a wafer so that a test system can check for electrical defects before the wafer is cut into individual chips.

Why is wafer-level testing performed before dicing?General reference — not yet source-verified

Testing before dicing prevents defective dice from being packaged and provides early feedback to the fabrication process, supporting higher yield and process control.

Not publicly documented

The following facts about the P 12 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the P 12 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the P 12 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the P 12 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the P 12 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the P 12 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (6)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]Inventory photo
  4. [4]Inventory photo
  5. [5]Equipment inventory listing
  6. [6]Equipment inventory listing
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Last updated Sep 29, 2026.

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