Thermotron
ATSS 130 15 15
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Thermotron ATSS 130 15 15 is a thermal cycling and thermal shock chamber. The Thermotron ATSS 130 15 15 is an automated thermal stress system. The Thermotron ATSS 130 15 15 has a hot zone temperature range of +25°C to +215°C.[1][2]
What it is
The Thermotron ATSS 130 15 15 is an Automated Thermal Stress System (ATSS) that functions as a thermal cycling and thermal shock chamber.[1]
Automated Thermal Stress Systems accelerate thermal stress testing with rapid thermal shocking, accelerated product stressing, and controlled thermal cycling.[2]
How it works
The ATSS 130 15 15 contains a hot zone with a temperature range of +25°C to +215°C and a cold zone with a temperature range of -73°C to +180°C.[1][2]
A transfer basket, with dimensions 25 x 23 x 14.5 inches (63 x 58 x 37 centimeters), moves product between the two zones in approximately 8 seconds via a retractable transfer mechanism.[1][2]
The ATSS 130 15 15 uses the 8825 Controller, a 12-inch touchscreen with features such as automatic and manual operation, product carrier transition management, data export via USB, Ethernet connectivity, and a multi-level password-based security system.[2]
The chamber employs Bi-Directional Zone Control, allowing heating and cooling in either zone, and uses product temperature control algorithms to manage the product's temperature based on user-defined parameters.[2]
Where it fits in the process flow
The chamber supports testing to industry standards including IEC, MIL-STD, JEDEC, and IPC specifications.[2]
Applications
The ATSS 130 15 15 is applied in automotive, military, aerospace, electronics, and telecommunications industries for thermal stress testing of products.[2]
What do the numbers mean?
Power & electrical4
- Electrical requirements at full load
- 460 / 3 / 60: 70 amps; 400 / 3 / 50: 80 amps; 230 / 3 / 60: 148 amps[1]
Wafer handling2
Control & software4
Dimensions & facilities3
Configuration & options14
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes can this system handle?General reference — not yet source-verified
The specific wafer size capacity is model-dependent, but thermal diffusion systems of this class are designed to accommodate standard semiconductor wafer diameters from two to six inches, depending on the tube diameter and boat configuration.
What types of gases are used in these systems?General reference — not yet source-verified
Common gases include nitrogen and argon for inert environments, oxygen and steam for oxidation, and dopant gases such as diborane, phosphine, or liquid sources like boron tribromide and phosphorus oxychloride, depending on the desired doping type.
How is temperature uniformity maintained across the wafer load?General reference — not yet source-verified
Temperature uniformity is achieved through multi-zone heating elements and thermocouple feedback control, along with careful gas flow design. Many systems use three or five temperature control zones to minimize radial and axial temperature gradients in the process tube.
What are common maintenance requirements for diffusion furnaces?General reference — not yet source-verified
Routine maintenance includes cleaning or replacing quartz process tubes, calibrating thermocouples, checking heater element continuity, and maintaining gas delivery systems. Tube cleaning is particularly important to remove accumulated deposits that can cause contamination or non-uniformity.
Not publicly documented
The following facts about the ATSS 130 15 15 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the ATSS 130 15 15 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the ATSS 130 15 15 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the ATSS 130 15 15 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the ATSS 130 15 15 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the ATSS 130 15 15 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]thermotron.com — thermotron.comthermotron.com
- [2]docs.alltest.net — docs.alltest.netdocs.alltest.net
- [3]Equipment inventory listing
- [4]waferpedia.comwaferpedia.com
Last updated Oct 7, 2026.
Compare with similar tools
View all →The Blue M 0 500 is an oven manufactured by Blue M, with asset number 139866.
