Temescal
4-pocket
The Temescal 4-pocket is a vacuum deposition electron-beam evaporation tool. The Temescal 4-pocket is used for controlled deposition of thin dielectric films. The Temescal 4-pocket is specified for 5" wafers.[1][2]
Plate 01J.M. Industries, INC 4 POCKET EBEAM GUN DEMO
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What it is
How it works
Where it fits in the process flow
General reference — not yet source-verifiedThe Temescal 4-pocket sits in the vacuum deposition segment of a fabrication flow.
The Temescal 4-pocket is used after patterning when a deposited film is needed for later use in optical, electrical, or metallization steps.
Applications
The Temescal 4-pocket is used for controlled deposition of thin dielectric films.[1]
The Temescal 4-pocket is used for optical coatings, electrical insulators, reactive ion etching masks, and metal deposition.[1][3][2]
- controlled deposition of thin dielectric films
- optical coatings (anti-reflective)
- electrical insulators
- reactive ion etching masks
- metal deposition
- n-type ohmic contact metalization to compound semiconductors
- Schottky contacts to semiconductors
- bond pads
- general metalizations
What do the numbers mean?
Power & electrical4
Vacuum & pumping10
Wafer handling4
Gas & chemistry3
Control & software6
- Controller (Dielectric System)
- Temescal TemEbeam Controller (EBC); controls HV, beam position (8 sweep patterns per pocket), pocket position[1]
- Deposition Controller
- Inficon IC/5 Thin Film Deposition Controller (Dielectric); Inficon IC/5 programmable crystal thickness monitoring system (Metal)[1]
Configuration & options15
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Tool typeVacuum Deposition[1]
- Power supplyTemescal CV-6SXL 10 kV power supply[1]
- Vacuum systemCryo-pumped system with low E-7 ultimate base pressure[1]
- Vacuum sequencingAutomatic vacuum sequencing via CHA Auto-Tech II[1]
- GasOxygen gas MFC for maintaining oxide stoichiometry[1]
- Power supplyTemescal CV-6S 10kV power supply[3]
- Vacuum systemCryo-pumped system with ~ 5e-7 ultimate base pressure[3]
- Vacuum sequencingAutomatic vacuum sequencing[3]
- Tool TypeVacuum Deposition (Electron-Beam Evaporation System)[1]
- Power Supply (Dielectric System)Temescal CV-6SXL 10 kV power supply[1]
- Power Supply (Metal System)Temescal CV-6S 10 kV power supply[3]
- Vacuum System (Dielectric)Cryo-pumped system with low E-7 ultimate base pressure[1]
- Vacuum System (Metal)Cryo-pumped system with ~ 5e-7 ultimate base pressure[3]
- Vacuum Sequencing (Dielectric)Automatic vacuum sequencing via CHA Auto-Tech II[1]
- Vacuum Sequencing (Metal)Automatic vacuum sequencing[3]
- GasOxygen gas MFC for maintaining oxide stoichiometry (Dielectric system)[1]
- Oxygen gasOxygen gas MFC for maintaining oxide stoichiometry[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the maximum sample size that can be placed in the system?
Samples up to 5" diameter can be placed into the system for evaporation.[1]
Can the substrate be heated during deposition?
Yes, a heated sample holder can be used, with programmable sample temperatures up to 370°C.[1]
What materials can be evaporated with this system?
The system can evaporate a wide variety of solid sources, with common dielectrics including SiO2, ITO, TiO2, Ta2O5, and SrF2; other materials may be evaporated upon request.[1]
How is deposition thickness controlled?
A crystal thickness monitor is used to control the deposition thickness.[1]
Can the system be used for co-deposition of metals?
Yes, dual 4-pocket e-beam sources allow for co-deposition of certain metals.[3]
What is the maximum deposition thickness in a single run?
The maximum deposition thickness during a run is limited to 1 micron.[3]
Not publicly documented
The following facts about the 4-pocket are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 4-pocket are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 4-pocket are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 4-pocket are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 4-pocket are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 4-pocket is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]wiki.nanotech.ucsb.edu — wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]wiki.nanotech.ucsb.edu — wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu
Last updated Oct 5, 2026.
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