Strasbaugh
70 R Edge
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
Where it fits in the process flow
General reference — not yet source-verifiedIn the semiconductor fabrication workflow, edge grinding is performed after wafer slicing from an ingot and before subsequent processes such as lapping, polishing, or lithography.
The edge grinding step removes saw marks, chips, and other irregularities from the wafer periphery, reducing the risk of crack propagation during later handling and processing.
Applications
General reference — not yet source-verifiedEdge grinders like the Strasbaugh 70 R Edge are used in the production of semiconductor wafers for various device types, including memory, logic, and power devices.
The equipment is generally applied to silicon wafers, as well as other semiconductor substrate materials such as gallium arsenide, silicon carbide, and sapphire.
What do the numbers mean?
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the Strasbaugh 70 R Edge?
It is a Strasbaugh 70 R edge grinder used in semiconductor manufacturing.[1]
Not publicly documented
The following facts about the 70 R Edge are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 70 R Edge are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 70 R Edge are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 70 R Edge are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 70 R Edge are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 70 R Edge is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 5, 2026.
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