Oxford Instruments
The Oxford Instruments Plasmalab-80plus-Cloey-S is an open load reactive ion etch system. The Oxford Instruments Plasmalab-80plus-Cloey-S is used for etching compound semiconductors and metals. The Oxford Instruments Plasmalab-80plus-Cloey-S is designed for 100 mm wafers.[1][2]

The Oxford Instruments Plasmalab-80plus-Cloey-S is a reactive ion etch (RIE) system designed for open-load operation. The system is classified as a dry etch tool for semiconductor processing.
The system supports wafer sizes up to 100 mm designed, with a maximum of 200 mm. Samples smaller than 100 mm and irregularly shaped pieces can be placed directly on the 238 mm platen.[1][2]
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The following facts about the Plasmalab-80plus-Cloey-S are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Plasmalab-80plus-Cloey-S are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Plasmalab-80plus-Cloey-S are on record.
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The control-system platform and OS era of the Plasmalab-80plus-Cloey-S are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Plasmalab-80plus-Cloey-S are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Plasmalab-80plus-Cloey-S is not on record.
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Last updated Oct 11, 2026.
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