Nordson
4000 PA Pull
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Nordson / Dage 4000 PA Pull is a pull tester. The 4000 PA Pull is categorized as Test & Probe equipment.[1][2]
What it is
General reference — not yet source-verifiedPull testers are used in semiconductor assembly and packaging to evaluate the mechanical strength of interconnects such as wire bonds, solder bumps, and stud bumps. The tester applies a controlled pulling force to the bonded structure until failure occurs, recording the maximum force and the mode of failure.
How it works
General reference — not yet source-verifiedA pull tester operates by gripping a bonded wire or bump with a hook, tweezer, or vacuum pickup tool and then raising the grip at a controlled speed or force rate. A load cell measures the force applied, and the test stops when the bond fails or a preset force limit is reached. The system records the pull force and may capture a force-vs-displacement curve.
Where it fits in the process flow
General reference — not yet source-verifiedPull testers are used after wire bonding or solder-bump reflow in the semiconductor packaging process. The tester is typically placed at a quality-control step where samples from each production lot are destructively tested to verify bond integrity and process stability.
Upstream operations include die attach, wire bonding (for gold or copper wires), or ball-mounting (for solder bumps). Downstream activities may include encapsulation, molding, and final test. The pull test results feed back to the bonding process to maintain yield and reliability.
Applications
General reference — not yet source-verifiedAdditional applications include testing of ribbon bonds, wedge bonds, and stud bumps in hybrid circuits, LED packages, and power modules. The machine supports a variety of test heads and fixturing to accommodate different package types and bond geometries.
What do the numbers mean?
No specifications recorded yet
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Where are the manuals?
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Not publicly documented
Field notes
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Frequently asked questions
Not publicly documented
The following facts about the 4000 PA Pull are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the 4000 PA Pull are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 4000 PA Pull are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 4000 PA Pull are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 4000 PA Pull are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 4000 PA Pull are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]4000 PA Pull — Nordson | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Sep 27, 2026.
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